参数资料
型号: THS4032CDGNRG4
厂商: Texas Instruments
文件页数: 12/47页
文件大小: 0K
描述: IC OPAMP VFB 100MHZ DUAL 8MSOP
标准包装: 2,500
放大器类型: 电压反馈
电路数: 2
转换速率: 100 V/µs
-3db带宽: 100MHz
电流 - 输入偏压: 3µA
电压 - 输入偏移: 500µV
电流 - 电源: 8.5mA
电流 - 输出 / 通道: 90mA
电压 - 电源,单路/双路(±): 9 V ~ 32 V,±4.5 V ~ 16 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
供应商设备封装: 8-MSOP-PowerPad
包装: 带卷 (TR)
配用: 296-10031-ND - EVAL MOD FOR THS4032
Vn
In
1
10
100
1 k
V
oltage
Noise
10
f Frequency Hz
VOLTAGE NOISE AND CURRENT NOISE
vs
FREQUENCY
20
10 k
100 k
V
n
nV/
Hz
VCC = ± 15 V AND ± 5 V
TA = 25°C
Current
Noise
I n
pA/
Hz
SLOS224G – JULY 1999 – REVISED MARCH 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS(1)
PACKAGED DEVICES
NUMBER OF
EVALUATION
PLASTIC
PLASTIC MSOP(2)(DGN)(3)
TA
CERAMIC DIP
CHIP CARRIER
CHANNELS
MODULE
SMALL
(JG)
(FK)
DEVICE
SYMBOL
OUTLINE(2) (D)
1
THS4031CD
THS4031CDGN
TIACM
THS4031EVM
0°C to 70°C
2
THS4032CD
THS4032CDGN
TIABD
THS4032EVM
1
THS4031ID
THS4031IDGN
TIACN
–40°C to 85°C
2
THS4032ID
THS4032IDGN
TIABG
–55°C to 125°C
1
THS4031MJG
THS4031MFK
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
The D and DGN packages are available taped and reeled. Add an R suffix to the device type (that is, THS4031CDGNR).
(3)
The PowerPAD on the underside of the DGN package is electrically isolated from all other pins and active circuitry. Connection to the
PCB ground plane is recommended, although not required, as this copper plane is typically the largest copper plane on the PCB.
2
Copyright 1999–2010, Texas Instruments Incorporated
Product Folder Link(s): THS4031 THS4032
相关PDF资料
PDF描述
AD8601WARTZ-R7 IC AMP GP R-R I/O SGL SOT23-5
52062-302LF METRAL REC PF SG CNR LF
MMA21-009 CONN RACK/PANEL 9POS 5A
ADA4850-2YCPZ-RL IC OPAMP VF R-R DUAL 16LFCSP
TSW-144-05-L-D CONN HEADER 88POS .100" DL GOLD
相关代理商/技术参数
参数描述
101-0454 功能描述:模块化系统 - SOM RCM2200 RABBITCORE RoHS:否 制造商:Digi International 外观尺寸:ConnectCore 9P 处理器类型:ARM926EJ-S 频率:150 MHz 存储容量:8 MB, 16 MB 存储类型:NOR Flash, SDRAM 接口类型:I2C, SPI, UART 工作电源电压:3.3 V 最大工作温度:+ 85 C 尺寸:1.97 in x 1.97 in x 6.1 in
101-0455 功能描述:单板计算机 BL2010 RoHS:否 制造商:Ampro By ADLINK 外观尺寸:EPIC 处理器类型:Intel Atom D510 频率:1.66 GHz 存储容量:2 GB (max) 存储类型:DDR2, L2 Cache 接口类型:Ethernet, PS/2, SATA, Serial, USB 工作电源电压:5 V, 12 V 功耗:13 W 最大工作温度:+ 70 C 尺寸:165.1 mm x 114.3 mm
10104558-G0250YYLF 制造商:FCI 功能描述:
101-0456 功能描述:单板计算机 BL2020 RoHS:否 制造商:Ampro By ADLINK 外观尺寸:EPIC 处理器类型:Intel Atom D510 频率:1.66 GHz 存储容量:2 GB (max) 存储类型:DDR2, L2 Cache 接口类型:Ethernet, PS/2, SATA, Serial, USB 工作电源电压:5 V, 12 V 功耗:13 W 最大工作温度:+ 70 C 尺寸:165.1 mm x 114.3 mm
101-0457 功能描述:单板计算机 BL2030 RoHS:否 制造商:Ampro By ADLINK 外观尺寸:EPIC 处理器类型:Intel Atom D510 频率:1.66 GHz 存储容量:2 GB (max) 存储类型:DDR2, L2 Cache 接口类型:Ethernet, PS/2, SATA, Serial, USB 工作电源电压:5 V, 12 V 功耗:13 W 最大工作温度:+ 70 C 尺寸:165.1 mm x 114.3 mm