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| 型号： | VJ1206A330JBBAT4X |
| 厂商： | Vishay Vitramon |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | CAP CER 33PF 100V 5% NP0 1206 |
| 标准包装： | 3,000 |
| 系列： | VJ |
| 电容： | 33pF |
| 电压 - 额定： | 100V |
| 容差： | ±5% |
| 温度系数： | C0G，NP0 |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | Boardflex 敏感 |
| 封装/外壳： | 1206（3216 公制） |
| 尺寸/尺寸： | 0.132" L x 0.063" W（3.35mm x 1.60mm） |
| 厚度（最大）： | 0.067"（1.70mm） |
| 特点： | 软端子，高电压 |
| 包装： | 带卷 (TR) |
VJ OMD Series
www.vishay.com
Vishay Vitramon
BOARDFLEX SENSITIVE APPLICATIONS - SOLUTION:
A predominant failure mode in multilayer ceramic chip capacitors is cracking caused by board flexure. Cracks can then create
a path for current to pass from one electrode through the dielectric to an opposing electrode or from the terminations at one
end of the MLCC through the dielectric to an opposing electrode. This may subsequently result in capacitance loss, leakage -
low Insulation Resistance (IR) - and/or more seriously, high current shorts. A short circuit condition in the surface mounted
capacitors can cause further failures of downstream components. Vishay’s Open Mode Design Capacitors (VJ OMD - Cap.
series) reduce the risk of these destructive conditions through MLCC designs that prevent board flexure cracks reaching the
opposing electrode.
VJ OMD - Cap. MLCCs reduce the risk of early field failures associated with board flex cracks. However, it is important to note
that even in the open mode designs the presence of flexure related cracks can cause capacitance loss leading to localized
stresses on the parts. eventually, depending on the application environment, including such factors and high voltage pulse
frequency and thermal cycling this may lead to internal breakdown of the component. ?
POLYMER TERMINATION
Polymer termination provides additional protection against board flexure damage by absorbing greater mechanical and thermal
stresses. Components can be packaged, transported, stored and handled the same standard terminated product. Wave and
reflow soldering of MLCC does not require modification to equipment and/or process. Polymer termination greatly reduces the
risk of mechanical cracking however it does not completely eliminate. ?
STANDARD TERMINATION
Exposed Electrodes = Electrical short
OMD CAP PLUS POLYMER TERMINATION
No Exposed Electrodes = No Electrical short
TYPICAL BEND TEST RESULTS 2220 CASE SIZE
100 %
90 %
80 %
70 %
60 %
50 %
40 %
30 %
20 %
10 %
0%
Standard Termination
Polymer Termination
Log. (Standard Termination)
Log. (Polymer Termination)
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
BOARD FLEXURE in (mm)
Revision: 22-Jul-13
14
Document Number: 45198
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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