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| 型号： | LD6806CX4/18P,315 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 25/36页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 200MA 1.8V 4WLCSP |
| 标准包装： | 9,000 |
| 系列： | * |
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NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 43 ) than a PbSn process, thus
reducing the process window
? Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 15 .
Table 15.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature ( ? C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 43 .
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
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