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参数资料
| 型号： | FBMJ4516HS720NT |
| 厂商： | Taiyo Yuden |
| 文件页数： | 12/15页 |
| 文件大小： | 0K |
| 描述： | FERRITE BEAD 72 OHM 1806 |
| 产品培训模块： | EMC Applications |
| 产品目录绘图： | FBM(H,J) Series_1806 |
| 标准包装： | 1 |
| 系列： | FBM |
| 频率对应阻抗： | 72 欧姆 @ 100MHz |
| 额定电流： | 6A |
| DC 电阻(DCR)： | 最大 7 毫欧 |
| 滤波器类型： | 差模 - 单线 |
| 封装/外壳： | 1806（4516 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 高度（最大）： | 0.051"（1.30mm） |
| 尺寸/尺寸： | 0.177" L x 0.063" W（4.50mm x 1.60mm） |
| 产品目录页面： | 1853 (CN2011-ZH PDF) |
| 其它名称： | 587-1776-6 |
9. Thermal Shock
Specified Value
Appearance
Impedance change
According to JIS C 0025.
Conditions for 1 cycle
: No significant abnormality
: Within＋50/－10% of the initial value
Step
Temperature (℃)
Duration (min.)
1 －40±3℃
30±3
Test Methods and
Remarks
2 Room Temperature
3 85±2℃
4 Room Temperature
Within 3
30±3
Within 3
Number of cycles
Mounting method
Recovery
10. Resistance to Humidity (steady state)
: 100
: Soldering onto PC board
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Specified Value
Test Methods and
Remarks
Appearances
Impedance change
Temperature
Humidity
Duration
Mounting method
Recovery
: No significant abnormality
: Within ±30% of the initial value
: 40±2℃
: 90 to 95% RH
: 500＋24/－0
: Soldering onto PC board
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
11. Loading under Damp Heat
Specified Value
Test Methods and
Remarks
Appearance
Impedance change
Temperature
Humidity
Applied current
Duration
Mounting method
Recovery
No significant abnormality
Within ±30% of the initial value
: 40±2℃
: 90 to 95%RH
: Rated current
: 500＋24/－0 hrs
: Soldering onto PC board
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
12. High Temperature Loading Test
Specified Value
Appearance
Impedance change
: No significant abnormality
: Within ±30% of the initial value
Temperature
:
85±2℃
Test Methods and
Remarks
Duration
Applied current
Mounting method
Recovery
:
:
:
:
500＋24/－0 hrs
Rated current
Soldering onto PC board
2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
13. Bending Strength
Specified Value
Appearance : No mechanical damage.
Warp
Testing board
Thickness
: 2mm
: Glass epoxy-resin substrate
: 0.8mm
Test Methods and
Remarks
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_reli_e-E02R01
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