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参数资料
| 型号： | U2K110CG100FB-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | CAP ARRAY 2CH 10PF 50V 0504 |
| 标准包装： | 10 |
| 电容： | 10pF |
| 电压 - 额定： | 50V |
| 电介质材料： | 陶瓷 |
| 电容器数量： | 2 |
| 电路类型： | 隔离 |
| 温度系数： | C0G，NP0 |
| 容差： | ±10% |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0504（1210 公制） |
| 尺寸/尺寸： | 0.054" L x 0.039" W（1.37mm x 1.00mm） |
| 高度 - 座高（最大）： | 0.024"（0.60mm） |
| 包装： | 剪切带 (CT) |
| 其它名称： | 587-1025-1 |
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
1. Circuit Design
◆ Veri?cation of operating environment, electrical rating and performance
1. A malfunction of equipment in ?elds such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social rami?cations.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
Precautions
pose applications.
◆ Operating Voltage （ Veri?cation of Rated voltage ）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
◆ Pattern con?gurations （ Design of Land-patterns ）
1. When capacitors are mounted on PCBs, the amount of solder used （ size of ?llet ） can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
（ 1 ） Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
Precautions
amount of solder.
（ 2 ） When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
◆ Pattern con?gurations （ Capacitor layout on PCBs ）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （ PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc. ） . For this reason, land pattern con?gurations and positions of capacitors
shall be carefully considered to minimize stresses.
◆ Pattern con?gurations （ Design of Land-patterns ）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（ 1 ） Recommended land dimensions for typical chip capacitors
● Multilayer Ceramic Capacitors : Recommended land dimensions （ unit: mm ）
Wave-soldering Land patterns for PCBs
Type
107 212 316 325
Land
Size
A
B
L
W
1.6 2.0 3.2 3.2
0.8 5 1.25 1.6 2.5
0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C
Chip capacitor
Solder-resist
C
0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Re?ow-soldering
B
A
B
Type
042 063 105 107
212
316
325
432
Size
A
L
W
0.4 0.6 1.0 1.6
0.2 0.3 0.5 0.8
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0
2.0
5 1.25
0.8 to 1.2
3.2
1.6
1.8 to 2.5
3.2
2.5
1.8 to 2.5
4.5
3.2
2.5 to 3.5
Chip capacitor
W
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8
0.8 to 1.2
1.0 to 1.5
1.0 to 1.5
1.5 to 1.8
C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
Note ： Recommended land size might be different according to the allowance of the size of the product.
● LWDC: Recommended land dimensions for re?ow-soldering （ unit: mm ）
L
LWDC
Type
105
107
212
Size
A
L
W
0.52
1.0
0.18 to 0.22
5 0.8
1.6
0.25 to 0.3
1.25
2.0
0.5 to 0.7
W
Technical
B
C
0.2 to 0.25
0.9 to 1.1
0.3 to 0.4
1.5 to 1.7
0.4 to 0.5
1.9 to 2.1
L
consider-
ations
（
● Array type: Recommended land dimensions for re?ow-soldering （ unit: mm ）
Type 096 （ 2 circuits ） 110 （ 2 circuits ） 212 （ 2 circuits ） 212 4 circuits ）
L 0.9 1.37 2.0 2.0
Size
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c
0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d
0.45 0.64 1.0 0.5
2 circuits
Chip capacitor
Land
c
d
a
b
a
4 circuits
c
d
a
b
a
（ 2 ） Examples of good and bad solder application
Items
Not recommended
Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
To next page
＊ This catalog contains the typical speci ?cation only due to the limitation of space. When you consider the purchase of our products, please check our speci ?cation.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec-P1
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mlcc_prec_e-01
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