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参数资料
| 型号： | U2K110CG100FB-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 15/16页 |
| 文件大小： | 0K |
| 描述： | CAP ARRAY 2CH 10PF 50V 0504 |
| 标准包装： | 10 |
| 电容： | 10pF |
| 电压 - 额定： | 50V |
| 电介质材料： | 陶瓷 |
| 电容器数量： | 2 |
| 电路类型： | 隔离 |
| 温度系数： | C0G，NP0 |
| 容差： | ±10% |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0504（1210 公制） |
| 尺寸/尺寸： | 0.054" L x 0.039" W（1.37mm x 1.00mm） |
| 高度 - 座高（最大）： | 0.024"（0.60mm） |
| 包装： | 剪切带 (CT) |
| 其它名称： | 587-1025-1 |
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
◆ Selection of Flux
Since ?ux may have a signi?cant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（ 1 ） Flux used shall be less than or equal to 0.1 wt% （ in CI equivalent ） of halogenated content. Flux having a strong acidity content shall not be applied.
（ 2 ） When shall capacitors are soldered on boards, the amount of ?ux applied shall be controlled at the optimum level.
（ 3 ） When water-soluble ?ux is used, special care shall be taken to properly clean the boards.
? Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100 ℃ .
Precautions
◆ Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆ Selection of Flux
1-1. When too much halogenated substance （ Chlorine, etc. ） content is used to activate ?ux, or highly acidic ?ux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much ?ux is applied, a large amount of ?ux gas may be emitted and may adversely affect
the solderability. To minimize the amount of ?ux applied, it is recommended to use a ?ux-bubbling system.
1-3. Since the residue of water-soluble ?ux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble ?ux is used.
◆ Soldering
? Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
as
? Therefore, the soldering must be conducted with great care so 300 to prevent malfunction of the components due to excessive thermal shock.
Peak 260 ℃ Max.
? Preheating : Capacitors shall be preheated suf?ciently, and the temperature difference between the capacitors and solder shall be within 100 to 130 ℃ .
Within 10sec.
［ Re?ow soldering ］
【 Recommended conditions for eutectic soldering 】
200
Slow
cooling
【 Recommended condition for Pb-free soldering 】
Slow cooling
cooling
100
200 60sec. Min.
Heating above
300
300
200
200
Preheating
60sec. 60sec.
Min. Min.
Peak 260 ℃ Max.
230 ℃
Within 10sec.
Within 10 sec.
Slow
cooling
300
0
Preheating 150 ℃
Peak 260 ℃ Max.
Within 10sec.
230 ℃
40sec. Max.
Slow
cooling
100
100
Peak 260 ℃ Max. 100 230 ～ 250 ℃
Preheating 150 ℃
Heating above Within 3sec.
230 ℃
230 ℃
Preheating 150 ℃
60sec. Min. 120sec. Min. 230 ℃
200 0 0
40sec. Max.
0
Slow cooling
Caution
① The 300
ideal condition is to have solder mass （ ?llet ） controlled 300 1/2 to 1/3 of the thickness of a capacitor.
to
② Because excessive dwell times can adversely affect solderability, soldering duration 230 ～ 250 ℃
100 230 ～ 250 ℃ 100
close to recommended times Within possible.
as
Within 3sec.
Heating above
Preheating
120sec. Min. 150 ℃ 230 ℃
200
60sec. Min.
［ Wave soldering ］ 40sec. Max. 200
Slow cooling
Slow cooling
【 Recommended conditions for eutectic soldering 】
【 Recommended condition for Pb-free soldering 】
100
100
Preheating
Technical
consider-
ations
300 300
100
300
0 0
Preheating Within 3sec.
120sec. Min.
Preheating
40sec. Max. 200 60sec. Min.
Slow 0
cooling
300 300
Preheating 150 ℃ Preheating Heating above
200 120sec. Min.
shall be kept as
Slow cooling
230 ～ 250 ℃ 100 Peak 260 ℃ Max.
Within 3sec. Within 10sec.
Solder
Capacitor
PC board
T
200 0 0
Slow cooling
Preheating
150 ℃
300
Peak 260 ℃ Max.
Within 10sec.
120sec. Min.
200
Slow
Preheating cooling
Preheating
cooling
150 ℃
150 ℃
① Wave soldering must not be applied to capacitors designated as for re?ow soldering only.
Peak 260 ℃ Max.
100
Within 3 sec.
120sec. Min.
［ Hand 200 0 0
Slow
【 Recommended conditions for eutectic soldering 】
【 Recommended condition for Pb-free soldering 】
Preheating
150 ℃
400
Peak 350 ℃ Max.
Peak 350 ℃ Max.
230 ～ 280 ℃ Within 3sec.
Within 3 3 sec.
Within sec.
100
300
300
300
300
0
Slow cooling
Slow cooling
0
200
Preheating cooling
Slow
400
400
150 Peak 350 ℃ Max.
230 ～ 280 ℃
Within 3sec.
100
Preheating Min.
⊿ T
0
Slow cooling
⊿ T
400
300
200
100
0 0
Peak 280 ℃ Max.
Peak 280 ℃ Max.
150 ℃ Peak 350 ℃ Max.
Within 3sec.
⊿ T
Slow cooling
Slow cooling
Preheating
60sec. Min.
⊿ T
120sec. Min. 120sec. Min.
200
0 Slow
cooling
300
100 Peak 260 ℃ Max. 100
Within 10sec.
120sec. Min.
200
0 Slow 0
cooling
Caution Preheating
100
230 ～ 280 ℃
Within 10sec.
300
soldering ］
0
cooling 200
400 400 Slow cooling
100 230 ～ 280 ℃
Within 3sec.
Within 3 sec.
⊿ ⊿ T T
300 Preheating
60sec. Min.
200 200
Slow cooling Preheating
100 100
Within 3 sec.
300 Preheating 300
60sec. Min. 60sec. Min.
0 0 60sec. Min.
200 200
⊿ T ≦
Slow cooling 316type or less Preheating 150 ℃
a of 1.0
Caution 150 ℃ Min.
① Use 100 50W soldering iron with a maximum tip diameter 100 mm.
② The soldering iron shall not directly touch capacitors.
Preheating
60sec. Min. 60sec. Min.
0 0
400
300
200
400
100
300
0
200
400
100
300
200
100
0
0
Peak 350 ℃ Max.
Within 3sec.
⊿ T
Slow cooling
Preheating
Within 3sec.
60sec. Min.
⊿ T Slow cooling
Preheating
℃ ℃ Min. 280
150 Peak Min. ℃ Max.
Within 3sec.
60sec. Min.
Slow cooling
⊿ T
⊿ T
325type or more Preheating ≦ 130 ℃
150 ℃ Min.
60sec. Min.
400
300
200
400
100
300
0
200
100
0
⊿ T
60sec. M
⊿ T
60sec.
＊ This catalog contains the typical speci ?cation only due to the limitation of space. When you consider the purchase of our products, please check our speci ?cation.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec-P3
12
mlcc_prec_e-01
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