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参数资料
| 型号： | MPC857DSLVR50B |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 7/88页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 50MHZ 357-PBGA |
| 标准包装： | 44 |
| 系列： | MPC8xx |
| 处理器类型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 50MHz |
| 电压： | 3.3V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 357-BBGA |
| 供应商设备封装： | 357-PBGA（25x25） |
| 包装： | 托盘 |
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MPC862/857T/857DSL PowerQUICC Family Hardware Specifications, Rev. 3
Freescale Semiconductor
15
Layout Practices
7.6
References
Semiconductor Equipment and Materials International
(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) Specifications
800-854-7179 or
(Available from Global Engineering Documents)
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and
Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
8
Layout Practices
Each VCC pin on the MPC862/857T/857DSL should be provided with a low-impedance path to the board’s
supply. Each GND pin should likewise be provided with a low-impedance path to ground. The power
supply pins drive distinct groups of logic on chip. The V
CC power supply should be bypassed to ground
using at least four 0.1 F by-pass capacitors located as close as possible to the four sides of the package.
The capacitor leads and associated printed circuit traces connecting to chip V
CC and GND should be kept
to less than half an inch per capacitor lead. A four-layer board is recommended, employing two inner
layers as VCC and GND planes.
All output pins on the MPC862/857T/857DSL have fast rise and fall times. Printed circuit (PC) trace
interconnection length should be minimized in order to minimize undershoot and reflections caused by
these fast output switching times. This recommendation particularly applies to the address and data busses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the V
CC and GND circuits. Pull up all unused inputs or signals that will be
inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
9
Bus Signal Timing
The maximum bus speed supported by the MPC862/857T/857DSL is 66 MHz. Higher-speed parts must
be operated in half-speed bus mode (for example, an MPC862/857T/857DSL used at 80MHz must be
configured for a 40 MHz bus). Table 6 shows the period ranges for standard part frequencies.
Table 6. Period Range for Standard Part Frequencies
Freq
50 MHz
66 MHz
80 MHz
100 MHz
Min
Max
Min
Max
Min
Max
Min
Max
Period
20.00
30.30
15.15
30.30
25.00
30.30
20.00
30.30
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