参数资料
型号: MPC7410THX400LE
厂商: Freescale Semiconductor
文件页数: 3/56页
文件大小: 0K
描述: IC MPU 32BIT 400MHZ 360-CBGA
标准包装: 44
系列: MPC74xx
处理器类型: 32-位 MPC74xx PowerPC
速度: 400MHz
电压: 1.8V
安装类型: 表面贴装
封装/外壳: 360-BBGA,FCCBGA
供应商设备封装: 360-FCCBGA(25x25)
包装: 托盘
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
11
Electrical and Thermal Characteristics
Table 5 provides the DC electrical characteristics for the MPC7410.
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the active portion of the die and the calculated case temperature at the top of the die.
The actual value of R JC is less than 0.1 °C/W.
Note: Refer to Section 8.8, “Thermal Management Information,” for details on thermal management.
Table 5. DC Electrical Specifications
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except
SYSCLK)
1.8
VIH
0.65
× (L2)OVDD
(L2)OVDD + 0.2
V
2, 3, 8
2.5
VIH
1.7
(L2)OVDD + 0.2
3.3
VIH
2.0
OVDD + 0.3
Input low voltage (all inputs except
SYSCLK)
1.8
VIL
–0.3
0.35
× (L2)OVDD
V8
2.5
VIL
–0.3
0.2
× (L2)OVDD
3.3
VIL
–0.3
0.8
SYSCLK input high voltage
1.8
CVIH
1.5
OVDD + 0.2
V
2, 8
2.5
CVIH
2.0
OVDD + 0.2
3.3
CVIH
2.4
OVDD + 0.3
SYSCLK input low voltage
1.8
CVIL
–0.3
0.2
V
8
2.5
CVIL
–0.3
0.4
3.3
CVIL
–0.3
0.4
Input leakage current,
Vin = L2OVDD/OVDD
1.8
Iin
—20
A
2, 3,
6, 7
2.5
Iin
—35
3.3
Iin
—70
Table 4. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
相关PDF资料
PDF描述
FMC28DRES CONN EDGECARD 56POS .100 EYELET
IDT71T75802S200BGI8 IC SRAM 18MBIT 200MHZ 119BGA
65801-015 CLINCHER RECEPTACLE ASS'-Y-TIN
AMC50DRAS CONN EDGECARD 100PS .100 R/A DIP
MC7410TVU400LE MPU RISC 32BIT 360-CBGA
相关代理商/技术参数
参数描述
ADA4858-3ACPZ-RL 功能描述:IC OPAMP CF TRPL LP 21MA 16LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:通用 电路数:2 输出类型:满摆幅 转换速率:1.8 V/µs 增益带宽积:6.5MHz -3db带宽:4.5MHz 电流 - 输入偏压:5nA 电压 - 输入偏移:100µV 电流 - 电源:65µA 电流 - 输出 / 通道:35mA 电压 - 电源,单路/双路(±):1.8 V ~ 5.25 V,±0.9 V ~ 2.625 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP,10-MSOP(0.118",3.00mm 宽) 供应商设备封装:10-MSOP 包装:管件
ADA4859-3 制造商:AD 制造商全称:Analog Devices 功能描述:Single-Supply, Fixed G = 2, High Speed, Video Amplifier with Charge Pump
ADA4859-3ACP-EBZ 功能描述:BOARD EVAL FOR ADA4859-3ACP RoHS:是 类别:编程器,开发系统 >> 评估演示板和套件 系列:* 标准包装:1 系列:- 主要目的:电信,线路接口单元(LIU) 嵌入式:- 已用 IC / 零件:IDT82V2081 主要属性:T1/J1/E1 LIU 次要属性:- 已供物品:板,电源,线缆,CD 其它名称:82EBV2081
ADA4859-3ACPZ-R2 制造商:Analog Devices 功能描述:VID AMP TRIPLE 5.5V 16LFCSP EP - Tape and Reel 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述:IC VIDEO AMPLIFIER TRI 195MHZ LFCSP16 制造商:Analog Devices 功能描述:Sngl Sup HghSpd GN+2 Amp Chrg Pump 制造商:Analog Devices 功能描述:IC, VIDEO AMPLIFIER, TRI, 195MHZ LFCSP16, Gain Bandwidth:195MHz, Supply Voltage Range:3V to 5.5V, Slew Rate:740V/s, No. of Amplifiers:3, Output Current:19mA, Amplifier Output:Single Ended, Operating Temperature Range:-40C to +105C, RoHS Compliant: Yes
ADA4859-3ACPZ-R7 功能描述:IC AMP 3CH CFB G=2 W/CP 16LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板:VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源,单路/双路(±):9 V ~ 20 V,±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件