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参数资料
| 型号： | ISL6613IRZ-T |
| 厂商： | Intersil |
| 文件页数： | 2/12页 |
| 文件大小： | 0K |
| 描述： | IC MOSFET DRVR SYNC BUCK 10-DFN |
| 标准包装： | 6,000 |
| 配置： | 高端和低端，同步 |
| 输入类型： | PWM |
| 延迟时间： | 10ns |
| 电流 - 峰： | 1.25A |
| 配置数： | 1 |
| 输出数： | 2 |
| 高端电压 - 最大（自引导启动）： | 36V |
| 电源电压： | 10.8 V ~ 13.2 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-VFDFN 裸露焊盘 |
| 供应商设备封装： | 10-DFN（3x3） |
| 包装： | 带卷 (TR) |
ISL6612, ISL6613
Ordering Information
PART
PART
TEMP. RANGE
PKG.
NUMBER
ISL6612CBZ (Note 2)
ISL6612CBZ-T (Notes 1, 2)
ISL6612CBZA (Note 2)
ISL6612CBZA-T (Notes 1, 2)
ISL6612CRZ (Note 2)
ISL6612CRZ-T (Notes 1, 2)
ISL6612ECB-T (Note 1)
ISL6612ECBZ (Note 2)
ISL6612ECBZ-T (Notes 1, 2)
ISL6612EIBZ (Note 2)
ISL6612EIBZ-T (Notes 1, 2)
ISL6612IBZ (Note 2)
ISL6612IBZ-T (Notes 1, 2)
ISL6612IRZ (Note 2)
ISL6612IRZ-T (Notes 1, 2)
ISL6613CBZ (Note 2)
ISL6613CBZ-T (Notes 1, 2)
ISL6613CRZ (Note 2)
ISL6613CRZ-T (Notes 1, 2)
ISL6613ECBZ (Note 2)
ISL6613ECBZ-T (Notes 1, 2)
ISL6613EIBZ (Note 2)
ISL6613EIBZ-T (Notes 1, 2)
ISL6613IBZ (Note 2)
ISL6613IBZ-T (Notes 1, 2)
ISL6613IRZ (Note 2)
ISL6613IRZ-T (Notes 1, 2)
MARKING
6612 CBZ
6612 CBZ
6612 CBZ
6612 CBZ
612Z
612Z
ISL66 12ECB
6612 ECBZ
6612 ECBZ
6612 EIBZ
6612 EIBZ
6612 IBZ
6612 IBZ
12IZ
12IZ
6613 CBZ
6613 CBZ
613Z
613Z
6613 ECBZ
6613 ECBZ
6613 EIBZ
6613 EIBZ
6613 IBZ
6613 IBZ
13IZ
13IZ
(°C)
0 to +85
0 to +85
0 to +85
0 to +85
0 to +85
0 to +85
0 to +85
0 to +85
0 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +85
0 to +85
0 to +85
0 to +85
0 to +85
0 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
PACKAGE
8 Ld SOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
8 Ld EPSOIC
8 Ld EPSOIC (Pb-Free)
8 Ld EPSOIC (Pb-Free)
8 Ld EPSOIC (Pb-Free)
8 Ld EPSOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
8 Ld SOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
8 Ld EPSOIC (Pb-Free)
8 Ld EPSOIC (Pb-Free)
8 Ld EPSOIC (Pb-Free)
8 Ld EPSOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
8 Ld SOIC (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
10 Ld 3x3 DFN (Pb-Free)
DWG. #
M8.15
M8.15
M8.15
M8.15
L10.3x3
L10.3x3
M8.15B
M8.15B
M8.15B
M8.15B
M8.15B
M8.15
M8.15
L10.3x3
L10.3x3
M8.15
M8.15
L10.3x3
L10.3x3
M8.15B
M8.15B
M8.15B
M8.15B
M8.15
M8.15
L10.3x3
L10.3x3
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-
020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL6612 , ISL6613 . For more information on MSL please see
techbrief TB363 .
2
FN9153.9
June 15, 2010
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