参数资料
型号: AM29LV200BB50DTE1
厂商: Advanced Micro Devices, Inc.
英文描述: 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
中文描述: 2兆位(256亩x 8-Bit/128亩x 16位),3.0伏的CMOS只,引导扇区快闪记忆体,修编模具1
文件页数: 7/11页
文件大小: 200K
代理商: AM29LV200BB50DTE1
November 18, 2003
Am29LV200B Known Good Die
7
S U P P L E M E N T
PACKAGING INFORMATION
Surftape Packaging
Gel-Pak and Waffle Pack Packaging
Direction of Feed
Orientation relative to
leading edge of tape
and reel
1
AMD logo location
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
相关PDF资料
PDF描述
AM29LV200BB50DTI1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB50DWC1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB50DWE1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB50DWI1 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
AM29LV200BB-60RDFC 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
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