参数资料
型号: APM3054NV
厂商: Anpec Electronics Corporation
英文描述: N-Channel Enhancement Mode MOSFET
中文描述: N沟道增强型MOS管
文件页数: 10/12页
文件大小: 213K
代理商: APM3054NV
Copyright
ANPEC Electronics Corp.
Rev. A.2 - Aug., 2002
APM3054N
www.anpec.com.tw
10
Reference JEDEC Standard J-STD-020A APRIL 1999
Reflow Condition
(IR/Convection or VPR Reflow)
Physical S pecifications
Pre-heat temperature
183 C
Peak temperature
Time
t
Classification Reflow Profiles
Convection or IR/
Convection
3
°
C/second max.
120 seconds max
60 – 150 seconds
VPR
Average ramp-up rate(183
°
C to Peak)
Preheat temperature 125 ± 25
°
C)
Temperature maintained above 183
°
C
Time within 5
°
C of actual peak temperature 10 –20 seconds
Peak temperature range
Ramp-down rate
Time 25
°
C to peak temperature
10
°
C /second max.
60 seconds
215-219
°
C or 235 +5/-0
°
C
10
°
C /second max.
220 +5/-0
°
C or 235 +5/-0
°
C
6
°
C /second max.
6 minutes max.
Package Reflow Conditions
pkg. thickness
2.5mm
and all bgas
Convection
220 +5/-0
°
C
VPR 215-219
°
C
IR/Convection 220 +5/-0
°
C
pkg. thickness < 2.5mm and
pkg. volume
350 mm3
pkg. thickness < 2.5mm and pkg.
volume < 350mm3
Convection 235 +5/-0
°
C
VPR 235 +5/-0
°
C
IR/Convection 235 +5/-0
°
C
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
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