参数资料
型号: GSM22DRST-S664
厂商: Sullins Connector Solutions
文件页数: 2/2页
文件大小: 0K
描述: CONN EDGECARD 44POS DIP .156 SLD
标准包装: 1
卡类型: 非指定 - 双边
类型: 母头
Number of Positions/Bay/Row: 22
位置数: 44
卡厚度: 0.125"(3.18mm)
行数: 2
间距: 0.156"(3.96mm)
安装类型: 通孔
端子: 焊接
触点材料: 磷青铜
触点表面涂层:
触点涂层厚度: 10µin(0.25µm)
触点类型:: 环形波纹管
颜色:
包装: 托盘
法兰特点: 齐平安装,顶开口,螺纹插件,4-40
材料 - 绝缘体: 聚酰胺(PA9T)
工作温度: -65°C ~ 125°C
读数:
Sullins Edgecards
.156” [3.96mm] Contact Centers, .610” Insulator Height
Dip Solder/Wire Wrap/Right Angle for .093”[2.36] or .125”[3.18] Mating PCB
PART NUMBER CODING
E B M 43 D RM D - S273
MATERIALS (Insulator/Contact)
MODIFICATION CODE (Consult Factory)
E = PBT/Phosphor Bronze (Standard)
R = PPS/Phosphor Bronze
G = PA9T/Phosphor Bronze
A = PPS/Beryllium Copper
J = PA9T/Beryllium Copper
-S273 =
-S664 =
FOR .093” ± .008” [2.36 ± .20]
THICK MATING PCB
FOR .125” ± .008” [3.18 ± .20]
THICK MATING PCB
(Consult Factory For Other Materials)
CONTACT FINISH - RoHS Compliant
All platings are Lead Free and have .000050” Nickel underplate
MOUNTING STYLE (Opposite Page)
N = No Mounting
D = Flush Mounting
T = Flush Mounting With Threaded Inserts
Contact Surface
Termination
Z = Flush Mounting With Side Holes
B
=
.000010” Gold
.000100” Pure Tin, Matte
C
G
Y
=
=
=
.000030” Gold
.000010” Gold
.000030” Gold
Contact Surface
.000100” Pure Tin, Matte
.000005” Gold
.000005” Gold
Overall Plating
TERMINATION TYPE (Opposite Page)
RS = .025” [.64mm] Square Dip Solder
RM = .025” [.64mm] Square Wire Wrap
TA, TB, TM = .025” [.64mm] Square Right Angle
S =
M =
E =
.000010” Gold
.000030” Gold
.000100” Pure Tin, Matte
.000010” Gold
.000010” Gold
.000100” Pure Tin, Matte
READOUT (Opposite Page)
D = Dual
CONTACT CENTERS
M = .156” [3.96mm]
DIMENSIONS Dimensions in [ ] are in millimeters, all others are in inches.
NUMBER OF CONTACT POSITIONS
See Chart Below
REFER TO MOUNTING STYLE
.297 [7.54] INSERTION DEPTH
C
.360
[9.14]
.470 [11.94]
.610
[15.49]
A
B
D
E
.060
[1.52]
.156 [3.96] TYP.
F
REFER TO
TERMINATION TYPE,
SEE OPPOSITE PAGE
Tolerances with PPS Insulator Material may vary slightly due to shrinkage differential; Consult Factory.
POSITIONS/
INCHES
[MILLIMETERS]
CONTACTS
A±.008 B±.008
C±.015 D±.010
E±.020
F±.015
A±0.20
B±0.20
C±0.38 D±0.25
E±0.51
F±0.38
06/12 0.780 1.102
08/16 1.092 1.414
10/20* 1.404 1.726
12/24 1.716 2.038
15/30* 2.184 2.506
18/36* 2.652 2.974
20/40* 2.964 3.286
22/44 3.276 3.598
24/48* 3.588 3.910
25/50* 3.744 4.066
28/56* 4.212 4.534
30/60* 4.524 4.846
31/62* 4.680 5.002
36/72 5.460 5.782
40/80* 6.084 6.406
43/86* 6.552 6.874
1.221 1.534
1.533 1.846
1.845 2.158
2.157 2.470
2.625 2.938
3.093 3.406
3.405 3.718
3.717 4.030
4.029 4.342
4.185 4.498
4.653 4.966
4.965 5.278
5.121 5.434
5.901 6.214
6.525 6.838
6.993 7.306
1.784
2.096
2.408
2.720
3.188
3.656
3.968
4.280
4.592
4.748
5.216
5.528
5.684
6.464
7.088
7.556
1.104
1.416
1.728
2.040
2.508
2.976
3.288
3.600
3.912
4.068
4.536
4.848
5.004
5.784
6.408
6.876
19.81
27.74
35.66
43.59
55.47
67.36
75.29
83.21
91.14
95.10
106.98
114.91
118.87
138.68
154.53
166.42
27.99
35.92
43.84
51.77
63.65
75.54
83.46
91.39
99.31
103.28
115.16
123.09
127.05
146.86
162.71
174.60
31.01 38.96
38.94 46.89
46.86 54.81
54.79 62.74
66.68 74.63
78.56 86.51
86.49 94.44
94.41 102.36
102.34 110.29
106.30 114.25
118.19 126.14
126.11 134.06
130.07 138.02
149.89 157.84
165.74 173.69
177.62 185.57
45.31
53.24
61.16
69.09
80.98
92.86
100.79
108.71
116.64
120.60
132.49
140.41
144.37
164.19
180.04
191.92
28.04
35.97
43.89
51.82
63.70
75.59
83.52
91.44
99.37
103.33
115.21
123.14
127.10
146.91
162.76
174.65
* Consult Factory for availability.
www.sullinscorp.com | 760-744-0125 | toll-free 888-774-3100 | fax 760-744-6081 | info@sullinscorp.com
65
相关PDF资料
PDF描述
4470-18J COIL RF 27UH MOLDED UNSHIELDED
GSC18DRXH-S734 CONN EDGECARD 36POS DIP .100 SLD
GEC43DRTN-S734 CONN EDGECARD 86POS DIP .100 SLD
EYM36DRMN-S664 CONN EDGECARD 72POS .156 WW
GEC43DRTH-S734 CONN EDGECARD 86POS DIP .100 SLD
相关代理商/技术参数
参数描述
ATMEGA324PA-MN 功能描述:8位微控制器 -MCU AVR 32KB FLSH 1KB EE 2KB SRAM-20MHz 105C RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA324PA-MNR 功能描述:20 MHZ, QFP, 105C 制造商:microchip technology 系列:AVR? ATmega 包装:剪切带(CT) 零件状态:在售 核心处理器:AVR 核心尺寸:8-位 速度:20MHz 连接性:I2C,SPI,UART/USART 外设:欠压检测/复位,POR,PWM,WDT I/O 数:32 程序存储容量:32KB(16K x 16) 程序存储器类型:闪存 EEPROM 容量:1K x 8 RAM 容量:2K x 8 电压 - 电源(Vcc/Vdd):1.8 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器类型:内部 工作温度:-40°C ~ 105°C(TA) 封装/外壳:44-VFQFN 裸露焊盘 供应商器件封装:44-VQFN(7x7) 标准包装:1
ATMEGA324PA-MU 功能描述:8位微控制器 -MCU AVR 32KB 1KB EE 20MHz 2KB SRAM 5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA324PA-MUR 功能描述:8位微控制器 -MCU AVR 32KB FLSH 1KB EE 2KB SRAM-20MHz IND RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA324PA-PN 功能描述:8位微控制器 -MCU AVR 32KB FLSH 1KB EE 2KB SRAM-20MHz 105C RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT