详细信息
贴片电容手工焊接 Manual Soldering
手工焊接很容易因为芯片局部受热不均而引起瓷体微裂或局部爆炸的现象,在焊接时,如果操作者不小
心,会使烙铁头直接同电容芯片的瓷体部分接触,这样很容易使电容芯片因热冲击而受损或出现其他意外.因
此,使用电烙铁手工焊接时应仔细操作,并对电烙铁的尖端的选择和尖端温度控制应多加小心.
Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip
comes into direct contact with the end terminations, and operator’s careless may cause the tip of the soldering iron
to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled
carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.