REV. A
–3–
DAC8408
@ V
DD
= +5 V; V
REF
=
6
10 V; V
OUT
A, B, C, D = 0 V; T
A
= –55
8
C to +125
8
C apply for
DAC8408AT/BT, T
A
= –40
8
C to +85
8
C apply for DAC8408ET/FT/FP/FPC/FS; T
A
= 0
8
C to +70
8
C apply for DAC8408GP, unless otherwse noted.
Specifications apply for DAC A, B, C, & D. Continued
ELECTRICAL CHARACTERISTICS
DAC8408
Min
Parameter
Symbol
Conditions
T yp
Max
Units
POWER SUPPLY
Voltage Range
Supply Current
8
Supply Current
9
V
DD
I
DD
I
DD
4.5
5.5
50
1.0
1.5
V
μ
A
mA
mA
T
A
= +25
°
C
T
A
= Full T emperature Range
NOT ES
1
T his is an end-point linearity specification.
2
Guaranteed to be monotonic over the full operating temperature range.
3
ppm/
°
C of FSR (FSR = Full Scale Range = V
-1 LSB.)
4
Input Resistance T emperature Coefficient = +300ppm/
°
C.
5
Logic Inputs are MOS gates. T ypical input current at +25
°
C Is less than 10 nA.
6
Guaranteed by design.
7
From Digital Input to 90% of final analog output current.
8
All Digital Inputs “0” or V
DD
.
9
All Digital Inputs V
IH
or V
IL
.
10
See T iming Diagram.
11
Digital Inputs = 0 V to V
DD
or V
DD
to 0 V.
12
Extrapolated: t
S
(1/2 LSB) = t
PD
+ 6.2
τ
where
τ
= the measured first time con-
stant of the final RC decay.
13
All Digital Inputs = 0 V; V
REF
= +10 V.
Specifications subject to change without notice.
Package T ype
u
JA
*
u
JC
Units
28-Pin Hermetic DIP (T )
28-Pin Plastic DIP (P)
28-Pin SOL (S)
28-Contact PLCC (PC)
55
53
68
66
10
27
23
29
°
C/W
°
C/W
°
C/W
°
C/W
*
θ
JA
is specified for worst case mounting conditions, i.e.,
θ
JA
is specified for
device in socket for cerdip and P-DIP packages;
θ
JA
is specified for device
soldered to printed circuit board for SOL and PLCC packages.
C AUT ION
1. Do not apply voltages higher than V
DD
+0.3 V or less than
–0.3 V potential on any terminal except V
REF
and R
FB
.
2. T he digital control inputs are diode-protected; however,
permanent damage may occur on unconnected inputs from
high energy electrostatic fields. K eep in conductive foam at
all times until ready to use.
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to both packaged devices
and DICE. Stresses above those listed under Absolute Maxi-
mum Ratings may cause permanent damage to the device.
ABSOLUT E MAX IMUM RAT INGS
(T
A
= +25
°
C, unless otherwise noted.)
V
DD
to I
OUT
2A
, I
OUT
2B
, I
OUT
2C
, I
OUT
2D
. . . . . . . . . .0 V, +7 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0 V, +7 V
I
OUT
1A
, I
OUT
1B
,
I
OUT 1C
, I
OUT 1D
to DGND . . . . . . . . . –0.3 V to V
DD
+0.3 V
R
FB
A, R
FB
B, R
FB
C, R
FB
D to I
OUT
. . . . . . . . . . . . . . . . .
±
25 V
I
OUT 2A
, I
OUT 2B
,
I
OUT 2C
, I
OUT 2D
to DGND . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
DB0 through DB7 to DGND . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Control Logic
Input Voltage to DGND . . . . . . . . . . –0.3 V + V
DD
+ 0.3 V
V
REF
A, V
REF
B, V
REF
C, V
REF
D to
I
OUT 2A
, I
OUT 2B
, I
OUT 2C
, I
OUT 2D
Operating T emperature Range
Commercial Grade (GP) . . . . . . . . . . . . . . . . 0
°
C to +70
°
C
Industrial Grade (ET , FT , FP, FPC, FS) . –40
°
C to +85
°
C
Military Grade (AT , BT ) . . . . . . . . . . . . . .–55
°
C to +125
°
C
Junction T emperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Storage T emperature . . . . . . . . . . . . . . . . . . .–65
°
C to +150
°
C
Lead T emperature (Soldering, 10 sec) . . . . . . . . . . . . . +300
°
C
. . . . . . . . . . . . . . . .
±
25 V
PIN CONNE CT IONS
DAC8408
TOP VIEW
(Not to Scale)