参数资料
型号: DPS512X32MFY3-35B
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, QMA68
封装: LEADLESS, STACK, SLCC-68
文件页数: 1/8页
文件大小: 811K
代理商: DPS512X32MFY3-35B
16 Megabit High Speed CMOS SRAM
DPS512X32MFn3
DESCRIPTION:
The DPS512X32MFn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The module packs 16-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in2, while maintaining a
total height as low as 0.269 inches.
The DPS512X32MFn3 STACK modules contain four individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
FEATURES:
Organizations Available:
512K x 32, 1Meg x 16 or 2 Meg x 8
Access Times:
20*, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Single +5V Power Supply,
±10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage:
2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
* Commercial and Industrial Grade only.
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A18
Address Inputs
I/O0 - I/O31
Data Input/Output
CE0 - CE3
Low Chip Enables
WE
Write Enable
OE
Output Enable
VDD
Power (+5V)
VSS
Ground
N.C.
No Connect
Gullwing
Leaded
Stack
‘’J’’ Leaded
Stack
SLCC Stack
Straight
Leaded
Stack
2Mx8/1Mx16/5Mx32, 20 - 45ns, STACK
30A154-04
A
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change products or specifications herein without prior notice.
30A154-04
REV. B
1
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