集成电路 (IC) IDT74SSTVN16859CPAG品牌、价格、PDF参数

IDT74SSTVN16859CPAG • 品牌、价格
元器件型号 厂商 描述 数量 价格
IDT74SSTVN16859CPAG IDT, Integrated Device Technology Inc IC BUFFER 13-26BIT SSTL 64-TSSOP 0
IDT74SSTVN16859CNLG8 IDT, Integrated Device Technology Inc IC BUFFER 13-26BIT SSTL 56VFQFPN 0
IDT74SSTVN16859CNLG IDT, Integrated Device Technology Inc IC BUFFER 13-26BIT SSTL 56VFQFPN 0
IDT74SSTV16859PAG8 IDT, Integrated Device Technology Inc IC BUFFER 13-26BIT SSTL 64-TSSOP 0
IDT74SSTUBH32865ABKG8 IDT, Integrated Device Technology Inc IC BUFFER 28BIT 1:2 REG 160-BGA 0
IDT74SSTUBH32865ABKG IDT, Integrated Device Technology Inc IC BUFFER 28BIT 1:2 REG 160-BGA 0
IDT74SSTUBF32865ABK8 IDT, Integrated Device Technology Inc IC BUFFER 28BIT 1:2 REG 160-BGA 0
IDT74SSTUBF32865ABK IDT, Integrated Device Technology Inc IC BUFFER 28BIT 1:2 REG 160-BGA 0
IDT74SSTU32865BKG8 IDT, Integrated Device Technology Inc IC BUFFER 28BIT 1:2 REG 160TFBGA 0
IDT74SSTU32865BKG IDT, Integrated Device Technology Inc IC BUFFER 28BIT 1:2 REG 160TFBGA 0
IDT74SSTU32864DBFG8 IDT, Integrated Device Technology Inc IC BUFFER 1:1/1:2 96-LFBGA 0
IDT74SSTU32864ABFG8 IDT, Integrated Device Technology Inc IC BUFFER 1:1/1:2 96-LFBGA 0
IDT74SSTVN16859CPAG • PDF参数
类别: 集成电路 (IC)
逻辑类型: 13 位至 26 位寄存缓冲器,带 SSTL_2 输入和输出
电源电压: 2.3 V ~ 2.7 V
位数: 13,26
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 64-TFSOP (0.240",6.10mm 宽)
供应商设备封装: 64-TSSOP
包装: 管件