| 元器件型号 | 厂商 | 描述 | 数量 | 价格 |
|---|---|---|---|---|
| C2012X7T2E473K/SOFT | TDK Corporation | CAP CER 0.047UF 250V X7T 0805 | 0 | 2,000:$0.06112 4,000:$0.05654 10,000:$0.05348 14,000:$0.05073 50,000:$0.04584 100,000:$0.04049 |
| CGA4J3X7R2E223K/SOFT | TDK Corporation | CAP CER 0.022UF 250V X7R 0805 | 0 | 1:$0.29000 10:$0.24100 100:$0.12040 250:$0.09032 500:$0.07980 1,000:$0.07076 |
| CGA4J3X7R2E223K/SOFT | TDK Corporation | CAP CER 0.022UF 250V X7R 0805 | 0 | 1:$0.29000 10:$0.24100 100:$0.12040 250:$0.09032 500:$0.07980 1,000:$0.07076 |
| CGA4J3X7R2E223K/SOFT | TDK Corporation | CAP CER 0.022UF 250V X7R 0805 | 0 | 2,000:$0.06022 4,000:$0.05570 10,000:$0.05269 14,000:$0.04998 50,000:$0.04517 100,000:$0.03990 |
| C2012Y5V1C225Z/10 | TDK Corporation | CAP CER 2.2UF 16V Y5V 0805 | 0 | 10,000:$0.05900 |
| 类别: | 电容器 |
|---|---|
| 电容: | 0.047µF |
| 电压 - 额定: | 250V |
| 容差: | ±10% |
| 温度系数: | X7T |
| 安装类型: | 表面贴装，MLCC |
| 工作温度: | -55°C ~ 125°C |
| 应用: | Boardflex 敏感 |
| 额定值: | - |
| 封装/外壳: | 0805（2012 公制） |
| 尺寸/尺寸: | 0.080" L x 0.050" W（2.03mm x 1.27mm） |
| 高度 - 座高（最大）: | - |
| 厚度: | |
| 厚度（最大）: | 0.049"（1.25mm） |
| 引线间隔: | - |
| 特点: | 软端子 |
| 包装: | 带卷 (TR) |
| 故障率: |