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参数资料
| 型号： | FT245RL-REEL |
| 厂商： | FTDI, Future Technology Devices International Ltd |
| 文件页数： | 26/37页 |
| 文件大小： | 0K |
| 描述： | IC USB TO PARALLEL FIFO 28-SSOP |
| 产品培训模块： | USB Introduction |
| 标准包装： | 1 |
| 应用： | USB 至 FIFO 控制器 |
| 接口： | USB，FIFO，（同步/异步） |
| 电源电压： | 1.8 V ~ 5.25 V |
| 封装/外壳： | 28-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 28-SSOP |
| 包装： | 标准包装 |
| 安装类型： | 表面贴装 |
| 产品目录页面： | 634 (CN2011-ZH PDF) |
| 配用： | 768-1020-ND - MOD USB PARALLEL FIFO DEV FT245R |
| 其它名称： | 768-1011-6 |
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Copyright 2010 Future Technology Devices International Limited
32
Document No.: FT_000052
FT245R USB FIFO IC Datasheet Version 2.12
Clearance No.: FTDI# 39
10.5 Solder Reflow Profile
The FT245R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow
profile for both package options is shown in 0.
Figure 10.5 FT245R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 10.1. Values are shown for
both a completely Pb free solder process (i.e. the FT245R is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT245R is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
240°C
Time within 5°C of actual Peak
Temperature (tp)
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature,
Tp
8 minutes Max.
6 minutes Max.
Table 10.1 Reflow Profile Parameter Values
Critical Zone: when
T is in the range
T to T
T
e
m
p
e
ra
tu
re
,
T
(D
e
g
re
e
s
C
)
Time, t (seconds)
25
P
T = 25 C to T
tp
Tp
TL
t
Preheat
S
t
L
Ramp Up
L
p
Ramp
Down
T Max
S
T Min
S
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FT245RL-TUBE | 制造商:Future Technology Devices International (FTDI Chip) 功能描述:USB FIFO IC 28-Pin SSOP Tube |
| FT245RQ | 制造商:Future Technology Devices International 功能描述:Single Chip USB 32-Pin QFN 制造商:Future Technology Devices International (FTDI Chip) 功能描述:IC USB TO FIFO SMD QFN-32 245 制造商:Future Technology Devices International (FTDI Chip) 功能描述:IC, USB TO FIFO, SMD, QFN-32, 245 制造商:Future Technology Devices International (FTDI Chip) 功能描述:USB Full Speed to Parallel FIFO IC, Includes Oscillator and EEPROM - QFN-32 制造商:Future Technology Devices International (FTDI Chip) 功能描述:IC, USB FIFO INTERFACE, QFN-32; USB Type:USB FIFO; USB Version:2.0; Supply Voltage Min:1.8V; Supply Voltage Max:5.25V; Digital IC Case Style:QFN; No. of Pins:32; Data Rate:1Mbps; No. of Ports:2; Operating Temperature Min:-40C ;RoHS Compliant: Yes |
| FT245RQ-6000 | 制造商:FTDI 制造商全称:FTDI 功能描述:USB FIFO IC - Single chip USB to parallel FIFO bidirectional data transfer interface |
| FT245RQ-REEL | 功能描述:USB 接口集成电路 USB to Parallel FIFO Enhanced IC QFN-32 RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20 |
| FT245RQ-TRAY | 制造商:Future Technology Devices International (FTDI Chip) 功能描述:Single Chip USB Tray |
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