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| 型号： | IP4364CX8 |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 电路保护 |
| 英文描述： | Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 |
| 封装： | IP4064CX8/LF/P<NAX000|<<<1<Always Pb-free,;IP4064CX8/LF<NAX000|<<<1<Always Pb-free,;IP4064CX8/LF/S<NAX000|<<<1<Always Pb-free,;IP4364CX8/LF<NAX000|<& |
| 文件页数： | 11/14页 |
| 文件大小： | 267K |
| 代理商： | IP4364CX8 |
IP4064CX8_IP4364CX8_IP4366CX8_2
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 11 February 2010
11 of 14
NXP Semiconductors
IP4064CX8; IP4364CX8; IP4366CX8
Integrated SIM card passive filter array with ESD protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”
.
9.3.4
Cleaning
Cleaning can be done after reflow soldering.
10. Abbreviations
11. Revision history
Table 8.
Document ID
IP4064CX8_IP4364CX8_
IP4366CX8_2
Modifications:
Table 7.
Acronym
DUT
EMI
ESD
NWA
PCB
PCS
RFI
RoHS
SIM
WLCSP
Abbreviations
Description
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
NetWork Analyzer
Printed-Circuit Board
Personal Communication System
Radio Frequency Interference
Restriction of Hazardous Substances
Subscriber Identity Module
Wafer-Level Chip-Scale Package
Revision history
Release date
20100211
Data sheet status Change notice Supersedes
Product data sheet -
IP4064CX8LF_IP4364CX8LF_1
Type number IP4366CX8 added
Figure 3
: added
General editorial update
Product data sheet -
IP4064CX8LF_IP4364CX8LF_1 20071112
-
相关PDF资料 |
PDF描述 |
|---|---|
| IP4366CX8 | Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 |
| IP4264CZ8-10-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-20-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-40-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-20 | Integrated USIM-SIM card passive filter arrays with ESD protection |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IP4364CX8/LF /T3 | 功能描述:多媒体杂项 INTEGRATED ESD RoHS:否 制造商:Texas Instruments 类型: 通道数量: 转换速率:540 Mbps 分辨率: 封装 / 箱体:SOIC-16 封装:Tube |
| IP4364CX8/LF,135 | 功能描述:ESD 抑制器 INTEGRATED ESD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4364CX8/LF/P | 制造商:NXP Semiconductors 功能描述:Tape & Reel 制造商:NXP Semiconductors 功能描述:EMI Filter 800MHz to 3000MHz Flat Style SMD |
| IP4364CX8/LF/P,135 | 功能描述:ESD 抑制器 Integrated SIM Card Passive Filter Array RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4365CX11 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4 |
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