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| 型号： | IP4364CX8 |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 电路保护 |
| 英文描述： | Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 |
| 封装： | IP4064CX8/LF/P<NAX000|<<<1<Always Pb-free,;IP4064CX8/LF<NAX000|<<<1<Always Pb-free,;IP4064CX8/LF/S<NAX000|<<<1<Always Pb-free,;IP4364CX8/LF<NAX000|<& |
| 文件页数： | 9/14页 |
| 文件大小： | 267K |
| 代理商： | IP4364CX8 |
IP4064CX8_IP4364CX8_IP4366CX8_2
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 11 February 2010
9 of 14
NXP Semiconductors
IP4064CX8; IP4364CX8; IP4366CX8
Integrated SIM card passive filter array with ESD protection
9. Soldering of WLCSP packages
9.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package”
and in application note
AN10365 “Surface
mount reflow soldering description”
.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
9.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
9.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 9
) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
Table 6
.
Table 6.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 9
.
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2 000
260
250
245
> 2 000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相关PDF资料 |
PDF描述 |
|---|---|
| IP4366CX8 | Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 |
| IP4264CZ8-10-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-20-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-40-TTL | Integrated (U)SIM card passive filter array with ESD protection |
| IP4264CZ8-20 | Integrated USIM-SIM card passive filter arrays with ESD protection |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IP4364CX8/LF /T3 | 功能描述:多媒体杂项 INTEGRATED ESD RoHS:否 制造商:Texas Instruments 类型: 通道数量: 转换速率:540 Mbps 分辨率: 封装 / 箱体:SOIC-16 封装:Tube |
| IP4364CX8/LF,135 | 功能描述:ESD 抑制器 INTEGRATED ESD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4364CX8/LF/P | 制造商:NXP Semiconductors 功能描述:Tape & Reel 制造商:NXP Semiconductors 功能描述:EMI Filter 800MHz to 3000MHz Flat Style SMD |
| IP4364CX8/LF/P,135 | 功能描述:ESD 抑制器 Integrated SIM Card Passive Filter Array RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| IP4365CX11 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Integrated (U)SIM card passive filter array and USB full speed ESD protection to IEC 61000-4-2 level 4 |
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