参数资料
型号: K6X1008C2D-DF70
厂商: SAMSUNG SEMICONDUCTOR CO. LTD.
元件分类: DRAM
英文描述: 128Kx8 bit Low Power CMOS Static RAM
中文描述: 128Kx8位低功耗CMOS静态RAM
文件页数: 4/10页
文件大小: 176K
代理商: K6X1008C2D-DF70
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
4
RECOMMENDED DC OPERATING CONDITIONS
1)
Note:
1. Commercial Product: T
=0 to 70
°
C, Otherwise specified
Industrial Product: T
A
=-40 to 85
°
C, Otherwise specified
Automotive Product: T
A
=-40 to 125
°
C, Otherwise specified
2. Overshoot: Vcc+3.0V in case of pulse width
30ns.
3. Undershoot: -3.0V in case of pulse width
30ns.
4. Overshoot and undershoot are sampled, not 100% tested.
Item
Symbol
Min
Typ
Max
Unit
Supply voltage
Vcc
4.5
5.0
5.5
V
Ground
Vss
0
0
0
V
Input high voltage
V
IH
2.2
-
Vcc+0.5
2)
0.8
V
Input low voltage
V
IL
-0.5
3)
-
V
CAPACITANCE
1
)
(f=1MHz, TA=25
°
C)
1. Capacitance is sampled, not 100% tested
Item
Symbol
Test Condition
Min
Max
Unit
Input capacitance
C
IN
V
IN
=0V
-
8
pF
Input/Output capacitance
C
IO
V
IO
=0V
-
10
pF
DC AND OPERATING CHARACTERISTICS
Item
Symbol
Test Conditions
Min
Typ Max Unit
Input leakage current
I
LI
V
IN
=Vss to Vcc
-1
-
1
μ
A
μ
A
Output leakage current
I
LO
CS
1
=V
IH
or CS
2
=V
IL
or OE=V
IH
or WE=V
IL
, V
IO
=Vss to Vcc
-1
-
1
Operating power supply current
I
CC
I
IO
=0mA, CS
1
=V
IL
, CS
2
=V
IH,
V
IN
=V
IH
or V
IL
, Read
-
-
5
mA
Average operating current
I
CC1
Cycle time=1
μ
s,
100%duty, I
IO
=0mA, CS
1
0.2V, CS
2
Vcc-0.2V,
V
IN
0.2V or V
IN
V
CC
-0.2V
-
-
7
mA
I
CC2
Cycle time=Min, 100% duty,
I
IO
=0mA, CS
1
=V
IL
, CS
2
=V
IH,
V
IN
=V
IH
or V
IL
-
-
25
mA
Output low voltage
V
OL
I
OL
=2.1mA
-
-
0.4
V
Output high voltage
V
OH
I
OH
=-1.0mA
2.4
-
-
V
Standby Current(TTL)
I
SB
CS
1
=V
IH
, CS2=V
IL
, Other inputs=V
IH
or V
IL
-
-
0.4
mA
Standby Current(CMOS)
I
SB1
CS
1
Vcc-0.2V, CS
2
Vcc-0.2V or
CS
2
0.2V, Other inputs=0~Vcc
K6X1008C2D-B
-
-
10
μ
A
μ
A
μ
A
K6X1008C2D-F
-
-
15
K6X1008C2D-Q
-
-
25
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