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参数资料
| 型号： | LZ1J010LR |
| 厂商： | DB Lectro Inc. |
| 英文描述： | CHIP TYPE, LOW IMPEDANCE |
| 中文描述： | 芯片类型，低阻抗 |
| 文件页数： | 8/13页 |
| 文件大小： | 423K |
| 代理商： | LZ1J010LR |
Do not locate any circuit pattern beneath the capacitor end seal.
11) Do not design a circuit board so that heat generating components are placed near an aluminum
electrolytic capacitor or reserve side of PC board (under the capacitor).
12) Please refer to the pad size layout recommendations in our catalogue when designing in surface
mount capacitors.
13) Electrical characteristics may vary depending on changes in temperature and frequency. Please
consider the variation when you design circuits.
14) When you install more than 2 capacitors in parallel, consider the balance of current following in to the
capacitor.
2. Mounting
1) Once a capacitor has been assembled in the set and power applied, do not attempt to re-use the
capacitor in other circuits or application.
2) Electric potential between positive and negative terminal may exist as a result of returned
electromotive force, so please discharge the capacitor using 1K
:
resistor.
3) Leakage current of the parts that have stored for long period may increase. When leakage current
has increased, please perform a voltage treatment using a 1K
:
resistor.
4) Please confirm rating and polarity before installing capacitor on the PC board.
5) Be careful not to deform the capacitor during installation.
6) Please confirm that the lead spacing of the capacitor matches the pad spacing of the PC board prior
to installation.
7) Please pay attention to the mechanical shock to the capacitor by suction nozzle of the automatic
insertion machine or automatic mounted, or by product checker, or by centering mechanism.
8) Reflow soldering
: Please see "Lead Free Reflow Soldering Condition" for chip type aluminum
electrolytic capacitors (page 8).
9) Do not tilt, lay down or twist the capacitor body after the capacitors are soldered to the PC board.
10) Do not carry the PC board by grasping the soldered capacitor.
11) Please do not allow anytime to touch the capacitor after soldering. If PC board are stored in stack,
please make sure PC board or the other components do not touch the capacitor. The capacitor shall
not be effected by any radiated heat from the soldered PC board or other components after
soldering.
12) Cleaning
M
Do not clean capacitors with halogenated cleaning agent. However, if it is necessary to clean with
halogenated cleaning agent, please contact our sales office.
N
Recommended cleaning method:
Applicable
: Any type, any ratings
Cleaning agents : Pine Alpha ST-100S, cleaning through 750H/750L/710M, Sanelek B-12, Aqua
Cleaner 210SEP, Techno Care FRW14~17, Isopropyl Alcohol.
10) The main chemical solution of the electrolyte and the separator paper in the capacitor are
combustible. The electrolyte is conductive. When it comes in contact with the PC board, there is a
possibility of pattern or short circuit between the circuit pattern, which could result in smoking or fire.
9) When designing a circuit board, please pay attention to the following:
M
Make the pad spacing on the PC board matching with the lead space of the capacitor.
N
There should not be any circuit pattern or circuit wire above the capacitor safety vent.
相关PDF资料 |
PDF描述 |
|---|---|
| LZ1J010LS | CHIP TYPE, LOW IMPEDANCE |
| LZ1J010LT | CHIP TYPE, LOW IMPEDANCE |
| LZ1J010MC | CHIP TYPE, LOW IMPEDANCE |
| LZ1J220LT | CHIP TYPE, LOW IMPEDANCE |
| LZ1J220MC | CHIP TYPE, LOW IMPEDANCE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LZ1J010LS | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1J010LT | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1J010MC | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1J010MR | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1J010MS | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
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