参数资料
| 型号： | RL0603FR-070R68L |
| 厂商： | Yageo |
| 文件页数： | 7/9页 |
| 文件大小： | 0K |
| 描述： | RES .68 OHM 1/10W 1% 0603 SMD |
| 产品培训模块： | Chip Resistor |
| 产品目录绘图： | Thin Film Resistor Top Thin Film Resistor Side |
| 标准包装： | 1 |
| 系列： | RL |
| 电阻（欧姆）： | 0.68 |
| 功率（瓦特）： | 0.1W，1/10W |
| 复合体： | 厚膜 |
| 特点： | 电流检测 |
| 温度系数： | ±300ppm/°C |
| 容差： | ±1% |
| 封装/外壳： | 0603（1608 公制） |
| 尺寸/尺寸： | 0.063" L x 0.031" W（1.60mm x 0.80mm） |
| 高度： | 0.022"（0.55mm） |
| 端子数： | 2 |
| 包装： | 标准包装 |
| 产品目录页面： | 2234 (CN2011-ZH PDF) |
| 其它名称： | 311-.68QDKR |
Product specification
7
Chip Resistor Surface Mount
RL
SERIES
0402 to 2512
9
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Life/
Endurance
High Temperature
Exposure/
Endurance at upper
category temperature
TEST METHOD
IEC 60115-1 4.25.1
IEC 60068-2-2
PROCEDURE
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at maximum operating
temperature depending on specification,
unpowered
No direct impingement of forced air to the
REQUIREMENTS
±2%
±1%
parts
Tolerances: 125±5 °C
Moisture Resistance
MIL-STD-202G Method-106G
Each temperature / humidity cycle is defined at
±2%
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
Thermal Shock
MIL-STD-202G Method-107G
-55/+125 °C
±1%
Note: Number of cycles required is 300.
Devices unmounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
Short time overload
IEC60115-1 4.13
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
±2%
No visible damage
temperature
Board Flex/
Bending
IEC 60068-2-21
Device mounted on PCB test board as
described, only 1 board bending required
±1%
No visible damage
3 mm bending
Bending time: 60±5 seconds
Ohmic value checked during bending
www.yageo.com
Mar 22, 2010 V.5
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