- 您现在的位置：买卖IC网 > PDF目录16707 > HMM08DRXN (Sullins Connector Solutions)CONN EDGECARD 16POS DIP .156 SLD PDF资料下载
参数资料
| 型号： | HMM08DRXN |
| 厂商： | Sullins Connector Solutions |
| 文件页数： | 2/2页 |
| 文件大小： | 0K |
| 描述： | CONN EDGECARD 16POS DIP .156 SLD |
| 标准包装： | 1 |
| 卡类型： | 非指定 - 双边 |
| 类型： | 母头 |
| Number of Positions/Bay/Row： | 8 |
| 位置数： | 16 |
| 卡厚度： | 0.062"（1.57mm） |
| 行数： | 2 |
| 间距： | 0.156"（3.96mm） |
| 安装类型： | 通孔 |
| 端子： | 焊接 |
| 触点材料： | 铜铍 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 30µin（0.76µm） |
| 触点类型：： | 全波纹管 |
| 颜色： | 蓝 |
| 包装： | 托盘 |
| 材料 - 绝缘体： | 聚对苯二甲酸丁二酯（PBT） |
| 工作温度： | -65°C ~ 125°C |
| 读数： | 双 |
Sullins Edgecards
.156” [3.96mm] Contact Centers, .431” Insulator Height
Dip Solder/Eyelet/Right Angle
PART NUMBER CODING
MATERIALS (Insulator/Contact)
E = PBT/Phosphor Bronze (Standard)
R = PPS/Phosphor Bronze
G = PA9T/Phosphor bronze
H = PBT/Beryllium Copper
A = PPS/Beryllium Copper
J = PA9T/Beryllium Copper
*F = PPS/Spinodal (Overall Gold Plating Only)
Consult Factory for Special Soldering Guidelines
*C = PPS/Beryllium Nickel (Overall Gold Plating Only)
*W = PEEK/Beryllium Nickel (Overall Gold Plating Only)
*Consult Factory for availability.
E B M 43 D RK H
- Sxxx
MODIFICATION CODE (Consult Factory)
OMIT FOR STANDARD
-S13 = Card Extender Accepts .062”[1.57] PCB
(RT, RK, RY, SE Terminations Only)
MOUNTING STYLE (Opposite Page)
H = .125”[3.18mm] Clearance Holes
N = No Mounting
S = Side Mounting
I = Threaded Insert
F = Floating Bobbin
TERMINATION TYPE (Opposite Page)
RA = .125” Right Angle Dip Solder
CONTACT FINISH - RoHS Compliant
All platings are Lead Free and have .000050” Nickel underplate
SA = Long Right Angle Dip Solder
RT = .140” x .137” Dip Solder
Contact Surface
Termination
RK = .140” x .225” Dip Solder
B
=
.000010” Gold
.000100” Pure Tin, Matte
RY = .140” x .425” Dip Solder
C =
G =
Y =
S =
M =
E =
.000030” Gold
.000010” Gold
.000030” Gold
Contact Surface
.000010” Gold
.000030” Gold
.000100” Pure Tin, Matte
.000100” Pure Tin, Matte
.000005” Gold
.000005” Gold
Overall Plating
.000010” Gold
.000010” Gold
.000100” Pure Tin, Matte
RX = .200” x .137” Dip Solder
RF = .200” x .200” Dip Solder
RU = .200” x .225” Dip Solder
RP = .200” x .408” Dip Solder
SX = .110” [2.79mm] Centered Dip Solder
SU = .210” [5.33mm] Centered Dip Solder
SE = .007” [.18mm] Thick Eyelet
RE = .014” [.36mm] Thick Eyelet
READOUT (Opposite Page)
CONTACT CENTERS
M = .156” [3.96mm]
NUMBER OF CONTACT POSITIONS
D = Dual
D = Dual Row/ Crimp to Center for
Single Readout (SX, SU Termination Only)
H = Half Loaded
See Chart Below
DIMENSIONS Dimensions in [ ] are in millimeters, all others are in inches.
CONTACT MARKINGS
(LETTERS G, I, O & Q NOT USED)
SIZE 02 THRU 25
.265 [6.73] INSERTION DEPTH
1 2 3 . . . 23 24 . . .
A B C . . . AA BB . . .
B
A
REFER TO
MOUNTING
STYLE
C
.245 [6.22]
.431 [10.95]
SIZES 28 THRU 44
1 2 3 . . . 23 24 . . .
A B C... A B ...
F
.025
[0.64]
1
A
2
B
3
C
41
_
W
42 43
_ _
X Y
F
D
E
.156 [3.96] TYP
REFER TO TERMINATION TYPE
Tolerances with PPS Insulator Material may vary slightly due to shrinkage differential; Consult Factory.
POSITIONS/
INCHES
[MILLIMETERS]
CONTACTS
02/04
03/06
06/12
08/16
10/20
11/22
12/24
15/30
18/36
22/44
24/48
25/50
28/56
36/72
43/86
44/88
A±.008
0.156
0.312
0.780
1.092
1.404
1.560
1.716
2.184
2.652
3.276
3.588
3.744
4.212
5.460
6.552
6.708
B±.008
0.476
0.632
1.100
1.412
1.724
1.880
2.036
2.504
2.972
3.596
3.908
4.064
4.532
5.780
6.872
7.028
C±.015 D±.010 E MAX
0.596 ‘N’ MOUNTING
0.752 ‘N’ MOUNTING
1.220 1.533 1.902
1.532 1.845 2.214
1.844 2.157 2.526
2.000 2.313 2.682
2.156 2.469 2.838
2.624 2.937 3.306
3.092 3.405 3.774
3.716 4.029 4.398
4.028 4.341 4.710
4.184 4.497 4.866
4.652 4.965 5.334
5.900 6.213 6.582
6.992 7.305 7.674
7.148 7.461 7.830
F±.005
0.325
0.438
0.500
A±0.20
3.96
7.92
19.81
27.74
35.66
39.62
43.59
55.47
67.36
83.21
91.14
95.10
106.98
138.68
166.42
170.38
B±0.20
12.09
16.05
27.94
35.86
43.79
47.75
51.71
63.60
75.49
91.34
99.26
103.23
115.11
146.81
174.55
178.51
C±0.38 D±0.25 E MAX
15.14 ‘N’ MOUNTING
19.10 ‘N’ MOUNTING
30.99 38.94 48.31
38.91 46.86 56.24
46.84 54.79 64.16
50.80 58.75 68.12
54.76 62.71 72.09
66.65 74.60 83.97
78.54 86.49 95.86
94.39 102.34 111.71
102.31 110.26 119.63
106.27 114.22 123.60
118.16 126.11 135.48
149.86 157.81 167.18
177.60 185.55 194.92
181.56 189.51 198.88
F±0.13
8.26
11.13
12.70
www.sullinscorp.com | 760-744-0125 | toll-free 888-774-3100 | fax 760-744-6081 | info@sullinscorp.com
59
相关PDF资料 |
PDF描述 |
|---|---|
| A3AAB-1418G | IDC CABLE- ASC14B/AE14G/ASC14B |
| 214A021-4/42-0 | BOOT MOLDED |
| HSM08DRXH | CONN EDGECARD 16POS DIP .156 SLD |
| 234A071-4-0 | BOOT MOLDED |
| V48C28T75BL | CONVERTER MOD DC/DC 28V 75W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC10EL52DTR2G | 功能描述:触发器 5V ECL Diff Data and Clk D-Type RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel |
| MC10EL57D | 功能描述:编码器、解码器、复用器和解复用器 5V ECL Diff 4:1 Mux RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| MC10EL57DG | 功能描述:编码器、解码器、复用器和解复用器 5V ECL Diff 4:1 Mux RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| MC10EL57DG | 制造商:ON Semiconductor 功能描述:MULTIPLEXER LOGIC IC |
| MC10EL57DR2 | 功能描述:编码器、解码器、复用器和解复用器 5V ECL Diff 4:1 Mux RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
发布紧急采购，3分钟左右您将得到回复。