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参数资料
| 型号： | MCM63P818ZP66 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | SRAM |
| 英文描述： | 256K X 18 CACHE SRAM, 7 ns, PBGA119 |
| 封装： | 7 X 17 MM, PLASTIC, BGA-119 |
| 文件页数： | 13/21页 |
| 文件大小： | 451K |
| 代理商： | MCM63P818ZP66 |
MCM63P736
MCM63P818
20
MOTOROLA FAST SRAM
TQ PACKAGE
TQFP
CASE 983A–01
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
–––
1.60
–––
0.063
A1
0.05
0.15
0.002
0.006
A2
1.35
1.45
0.053
0.057
b
0.22
0.38
0.009
0.015
b1
0.22
0.33
0.009
0.013
c
0.09
0.20
0.004
0.008
c1
0.09
0.16
0.004
0.006
D
22.00 BSC
0.866 BSC
E
16.00 BSC
0.630 BSC
E1
14.00 BSC
0.551 BSC
e
0.65 BSC
0.026 BSC
L
0.45
0.75
0.018
0.030
L1
1.00 REF
0.039 REF
L2
0.50 REF
S
0.20
–––
0.008
–––
R1
0.08
–––
0.003
–––
R2
0.08
0.20
0.003
0.008
q
0
7
0
7
q
0
–––
0
–––
q
11
13
11
13
q
11
13
11
13
1
2
3
D1
20.00 BSC
0.787 BSC
0.020 REF
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS D1 AND B1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE b DIMENSION TO EXCEED 0.45
(0.018).
A–B
0.20 (0.008) H
e
D
A–B
0.20 (0.008) C
D
A–B
0.20 (0.008) C
D
0.10 (0.004) C
0.25 (0.010)
S
0.05 (0.002)
S
A–B
M
0.13 (0.005)
D S
C
e/2
D/2
E
E1
D1
D
D1/2
E1/2
E/2
4X
2X 30 TIPS
2X 20 TIPS
–D–
–B–
–A–
–C–
–H–
q1
q3
q2
q
100
81
80
51
50
31
30
1
PLATING
SECTION B–B
c1
c
b
b1
BASE
METAL
A
SEATING
PLANE
VIEW AB
S
VIEW AB
A2
A1
R1
L2
L
L1
R2
GAGE PLANE
–X–
VIEW Y
B
X=A, B, OR D
PACKAGE DIMENSIONS
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S
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I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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