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参数资料
| 型号： | 935288885112 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 网络接口 |
| 英文描述： | DATACOM, INTERFACE CIRCUIT, PDSO8 |
| 封装： | 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 |
| 文件页数： | 7/24页 |
| 文件大小： | 214K |
| 代理商： | 935288885112 |
2000 Jan 13
15
Philips Semiconductors
Product specication
CAN transceiver for 24 V systems
PCA82C251
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(2)
suitable
Surface mount
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5) suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCZ33905BD3EKR2 | 功能描述:CAN 接口集成电路 3.3V SBC HSCAN DUAL LIN RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MCZ33905BD3R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:SBC Gen2 with CAN High Speed and LIN Interface |
| MCZ33905BD5EK | 功能描述:CAN 接口集成电路 5.0V SBC HSCAN DUAL LIN RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MCZ33905BD5EKR2 | 功能描述:CAN 接口集成电路 5.0V SBC HSCAN DUAL LIN RoHS:否 制造商:Texas Instruments 类型:Transceivers 工作电源电压:5 V 电源电流: 工作温度范围:- 40 C to + 85 C 封装 / 箱体:SOIC-8 封装:Tube |
| MCZ33905BD5R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:SBC Gen2 with CAN High Speed and LIN Interface |
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