参数资料
型号: PC28F128J3C-120
厂商: INTEL CORP
元件分类: PROM
英文描述: Intel StrataFlash Memory (J3)
中文描述: 8M X 16 FLASH 2.7V PROM, 120 ns, PBGA64
封装: LEAD FREE, BGA-64
文件页数: 1/72页
文件大小: 905K
代理商: PC28F128J3C-120
Intel StrataFlash
Memory (J3)
256-Mbit (x8/x16)
Datasheet
Product Features
Capitalizing on Intel’s 0.25 and 0.18 micron, two-bit-per-cell technology, the Intel StrataFlash
Memory (J3)
device provides 2X the bits in 1X the space, with new features for mainstream performance. Offered in 256-
Mbit (32-Mbyte), 128-Mbit (16-Mbyte), 64-Mbit, and 32-Mbit densities, the J3 device brings reliable, two-bit-
per-cell storage technology to the flash market segment. Benefits include more density in less space, high-speed
interface, lowest cost-per-bit NOR device, support for code and data storage, and easy migration to future
devices.
Using the same NOR-based ETOX technology as Intel’s one-bit-per-cell products, the J3 device takes
advantage of over one billion units of flash manufacturing experience since 1987. As a result, J3 components
are ideal for code and data applications where high density and low cost are required. Examples include
networking, telecommunications, digital set top boxes, audio recording, and digital imaging.
By applying FlashFile memory family pinouts, J3 memory components allow easy design migrations from
existing Word-Wide FlashFile memory (28F160S3 and 28F320S3), and first generation Intel StrataFlash
memory (28F640J5 and 28F320J5) devices.
J3 memory components deliver a new generation of forward-compatible software support. By using the
Common Flash Interface (CFI) and the Scalable Command Set (SCS), customers can take advantage of density
upgrades and optimized write capabilities of future Intel StrataFlash
memory devices. Manufactured on Intel
0.18 micron ETOX VII (J3C) and 0.25 micron ETOX VI (J3A) process technology, the J3 memory device
provides the highest levels of quality and reliability.
Performance
—110/115/120/150 ns Initial Access Speed
—125 ns Initial Access Speed (256 Mbit
density only)
—25 ns Asynchronous Page mode Reads
—30 ns Asynchronous Page mode Reads
(256Mbit density only)
—32-Byte Write Buffer
—6.8 μs per byte effective
programming time
Software
—Program and Erase suspend support
—Flash Data Integrator (FDI), Common
Flash Interface (CFI) Compatible
Security
—128-bit Protection Register
—64-bit Unique Device Identifier
—64-bit User Programmable OTP Cells
—Absolute Protection with V
PEN
= GND
—Individual Block Locking
—Block Erase/Program Lockout during
Power Transitions
Architecture
—Multi-Level Cell Technology: High
Density at Low Cost
—High-Density Symmetrical 128-Kbyte
Blocks
—256 Mbit (256 Blocks) (0.18μm only)
—128 Mbit (128 Blocks)
6
4 Mbit (64 Blocks)
—32 Mbit (32 Blocks)
Quality and Reliability
—Operating Temperature:
-40 °C to +85 °C
—100K Minimum Erase Cycles per Block
—0.18 μm ETOX VII Process (J3C)
—0.25 μm ETOX VI Process (J3A)
Packaging and Voltage
—56-Lead TSOP Package
—64-Ball Intel
Easy BGA Package
—Lead-free packages available
—48-Ball Intel
VF BGA Package (32 and
64 Mbit) (x16 only)
—V
CC
=
2.7 V to 3.6 V
—V
CCQ
= 2.7 V to 3.6 V
Order Number: 290667-021
March 2005
Notice:
This document contains information on new products in production. The specifications are
subject to change without notice. Verify with your local Intel sales office that you have the latest
datasheet before finalizing a design.
相关PDF资料
PDF描述
PC28F128J3C-125 Intel StrataFlash Memory (J3)
PC28F128J3C-150 Intel StrataFlash Memory (J3)
PC28F256J3A-125 Intel StrataFlash Memory (J3)
PC28F256J3A-150 Intel StrataFlash Memory (J3)
PC28F256J3C-120 Intel StrataFlash Memory (J3)
相关代理商/技术参数
参数描述
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PC28F128J3D75A 功能描述:IC FLASH 128MBIT 75NS 64EZBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:StrataFlash™ 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ
PC28F128J3D75B 功能描述:IC FLASH 128MBIT 75NS 64EZBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:StrataFlash™ 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ