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参数资料
| 型号： | PCF8579U7 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 显示驱动器 |
| 英文描述： | LCD column driver for dot matrix graphic displays |
| 中文描述： | LIQUID CRYSTAL DISPLAY DRIVER, UUC55 |
| 封装： | DIE-56 |
| 文件页数： | 37/40页 |
| 文件大小： | 287K |
| 代理商： | PCF8579U7 |
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1997 Apr 01
37
Philips Semiconductors
Product specification
LCD column driver for dot matrix graphic
displays
PCF8579
18 SOLDERING
18.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
18.2
Reflow soldering
Reflow soldering techniques are suitable for all LQFP and
VSO packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
18.3
Wave soldering
18.3.1
LQFP
Wave soldering is
not
recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
°
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).
18.3.2
VSO
Wave soldering techniques can be used for all VSO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
18.3.3
M
ETHOD
(LQFP
AND
VSO)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
18.4
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
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| PCF8582C2D | 制造商:NXP Semiconductors 功能描述: 制造商:NXP Semiconductors 功能描述:EEPROM Serial-I2C 2K-Bit 256 x 8 3.3V/5V 8-Pin SO Tube |
| PCF8582C2N | 功能描述:电可擦除可编程只读存储器 电可擦除可编程只读存储器 256X8 W/I2C 100KHZ -40+85 RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
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