参数资料
型号: AD8137YRZ-REEL7
厂商: Analog Devices Inc
文件页数: 25/33页
文件大小: 0K
描述: IC AMP DIFF R-R LP 20MA 8SOIC
标准包装: 1,000
放大器类型: 差分
电路数: 1
输出类型: 差分,满摆幅
转换速率: 450 V/µs
-3db带宽: 110MHz
电流 - 输入偏压: 500nA
电压 - 输入偏移: 700µV
电流 - 电源: 3.2mA
电流 - 输出 / 通道: 20mA
电压 - 电源,单路/双路(±): 2.7 V ~ 12 V,± 2.7 V ~ 6 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
AD8137
Data Sheet
Rev. E | Page 30 of 32
ORDERING GUIDE
Model1, 2
Temperature Range
Package Description
Package Option
Branding
AD8137YR
40°C to +125°C
8-Lead Standard Small Outline Package (SOIC_N)
R-8
AD8137YR-REEL7
40°C to +125°C
8-Lead Standard Small Outline Package (SOIC_N)
R-8
AD8137YRZ
40°C to +125°C
8-Lead Standard Small Outline Package (SOIC_N)
R-8
AD8137YRZ-REEL
40°C to +125°C
8-Lead Standard Small Outline Package (SOIC_N)
R-8
AD8137YRZ-REEL7
40°C to +125°C
8-Lead Standard Small Outline Package (SOIC_N)
R-8
AD8137YCPZ-R2
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_WD)
CP-8-13
HFB#
AD8137YCPZ-REEL
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_WD)
CP-8-13
HFB#
AD8137YCPZ-REEL7
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_WD)
CP-8-13
HFB#
AD8137WYCPZ-R7
–40°C to +125°C
8-Lead Lead Frame Chip Scale Package (LFCSP_WD)
CP-8-13
H2G
AD8137YCP-EBZ
LFCSP Evaluation Board
AD8137YR-EBZ
SOIC Evaluation Board
1
Z = RoHS Compliant Part; # denotes that RoHS part may be top or bottom marked.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The AD8137W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
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