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参数资料
| 型号： | RK80530KZ006512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 1133 MHz, MICROPROCESSOR, CPGA370 |
| 封装： | FLIP CHIP, PGA-370 |
| 文件页数： | 2/94页 |
| 文件大小： | 1775K |
| 代理商： | RK80530KZ006512 |
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2
Datasheet
Intel Pentium III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
1.1
Terminology
In this document, a ‘#’ symbol after a signal name refers to an active low signal. This means that a
signal is in the active state (based on the name of the signal) when driven to a low level. For
example, when FLUSH# is low, a flush has been requested. When NMI is high, a nonmaskable
interrupt has occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies that the signal
is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to
a hex ‘A’ (H= High logic level, L= Low logic level).
The term “system bus” refers to the interface between the processor, system core logic (a.k.a. the
chipset components), and other bus agents.
1.1.1
Package and Processor Terminology
The following terms are used often in this document and are explained here for clarification:
Intel Pentium III processor with 512KB L2 Cache - The entire product including all
internal components.
PGA370 socket - 370-pin Zero Insertion Force (ZIF) socket which a FC-PGA packaged
processor plugs into.
FC-PGA - Flip Chip Pin Grid Array. The package technology used on Intel Pentium III
processor (CPUID = 068xh) for the PGA370 socket. The FC-PGA package has the processor
die exposed.
FC-PGA2 - Flip Chip Pin Grid Array 2. The package technology used on the Intel
Pentium III processor with 512KB L2 Cache for the PGA370 socket. The FC-PGA2 package
contains an Integrated Heat Spreader which covers the processor die.
Advanced Transfer Cache (ATC) - L2 cache architecture used on the Intel Pentium III
processors. ATC consists of microarchitectural improvements that provide a higher data
bandwidth interface into the processor core that is completely scaleable with the processor
core frequency.
Keep-out zone - The area on or near a FC-PGA2 packaged processor that system designs can
not utilize.
Keep-in zone - The area of a FC-PGA2 packaged processor that thermal solutions may utilize.
Processor - For this document, the term processor is the generic form of the Intel Pentium
III processor with 512KB L2 Cache for the PGA370 socket in the FC-PGA2 package.
Processor core - The processor’s execution engine.
Integrated Heat Spreader (IHS) - The Integrated Heat Spreader (IHS) is a metal cover on the
die and it is an integral part of the CPU. The IHS promotes heat spreading away from the die
backside to ease thermal constraints.
The cache and L2 cache are industry designated names.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80530KZ012512 | 制造商:Intel 功能描述:MPU Pentium 制造商:Rochester Electronics LLC 功能描述:P3 (TUALATIN) 1.26GHZ 512 CACHE (FOR SERVERS) 133 FSB; 1.45V - Bulk |
| RK80530KZ012512S L5QL | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor-S 64-Bit 0.13um 1.26GHz 370-Pin FCPGA2 |
| RK80530KZ012512S L6BX | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor-S 64-Bit 0.13um 1.26GHz 370-Pin FCPGA 制造商:Intel 功能描述:MPU PENTIUM III 64BIT 0.13UM 1.266GHZ 370PIN FCPGA2 - Trays |
| RK80530KZ017512 | 制造商:Rochester Electronics LLC 功能描述:P3 (TUALATIN) 1.4HZ 512 CACHE (FOR SERVERS) 133 FSB; 1.45V - Bulk |
| RK80530KZ017512S L5XL | 制造商:Intel 功能描述:32BIT MPU 80530KZ017512 1.40G |
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