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参数资料
| 型号： | SFC05-4.TM |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| 封装： | FLIP CHIP, CSP-6 |
| 文件页数： | 6/8页 |
| 文件大小： | 190K |
| 代理商： | SFC05-4.TM |
6
2003 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-4
Printed Circuit Board Finish
A uniform board finish is critical for good assembly
yield. Two finishes that provide uniform surface coat-
ings are immersion nickel gold and organic surface
protectant (OSP). A non-uniform finish such as hot air
solder leveling (HASL) can lead to mounting problems
and should be avoided.
Stencil Design
A properly designed stencil is key to achieving ad-
equate solder volume without compromising assembly
yields. A 0.100mm thick, laser cut, electro-polished
stencil with 0.275mm square apertures and rounded
corners is recommended.
Reflow Profile
The flip chip TVS can be assembled using standard
SMT reflow processes. As with any component, ther-
mal profiles at specific board locations can vary and
must be determined by the manufacturer. The flip chip
TVS peak reflow temperature is 230 ± 10 °C. Time
above eutectic temperature (183 °C) should be 50 ±
10 seconds. During reflow, the component self-aligns
itself on the pad.
Circuit Board Layout Recommendations for Suppres-
sion of ESD
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
"
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
"
Minimize the path length between the TVS and the
protected line.
"
Minimize all conductive loops including power and
ground loops.
"
The ESD transient return path to ground should be
kept as short as possible.
"
Never run critical signals near board edges.
"
Use ground planes whenever possible.
Applications Information (Continued)
Reflow Profile
Stencil Design
相关PDF资料 |
PDF描述 |
|---|---|
| SFC05-4.WFT | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFC05-4.WMT | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFC05-5-T710-2 | 250 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE |
| SFC05-5.WMT | 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFF1605G | 16 A, 300 V, SILICON, RECTIFIER DIODE, TO-220AB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SFC05-5 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-5.TC | 制造商:Semtech Corporation 功能描述:CHIPCLAMP FLIP CHIP TVS DIODE ARRAY |
| SFC05-5.WCT | 制造商:Semtech Corporation 功能描述:Diode |
| SFC05-5_07 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-5_10 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:250w flip chip tvs array |
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