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参数资料
| 型号： | SL38160ZI-XXXT |
| 厂商： | SILICON LABORATORIES |
| 元件分类： | 时钟产生/分配 |
| 英文描述： | 200 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO16 |
| 封装： | ROHS COMPLIANT, TSSOP-16 |
| 文件页数： | 11/11页 |
| 文件大小： | 171K |
| 代理商： | SL38160ZI-XXXT |
Rev 1.1, January 5, 2009
Page 9 of 11
SL38160
Comments and Recommendations
Decoupling Capacitor:
A decoupling capacitor of 0.1μF must be used between all VDD and VSS pins on PCB.
Place the capacitor on the component side of the PCB as close to the VDD pins as possible. The PCB trace to the
VDD pins and to the GND via should be kept as short as possible Do not use vias between the decoupling capacitor
and the VDD pins.
Series Termination Resistor: A series termination resistor is recommended if the distance between the outputs
(CLKOUT or REFCLK pins) and the load is over 1 inch. The nominal impedance of the all clock outputs are about
25
Ω. Use 20 Ω resistor in series with the output to terminate 50Ω trace impedance and place 20 Ω resistor as close
to the SSCLK output as possible.
Crystal and Crystal Load (XO Mode): Use only parallel resonant fundamental crystals. DO NOT USE higher
overtone crystals. To meet the crystal initial accuracy specification (in ppm); the internal on-chip programmable
capacitors PCin and PCout must be programmed to match the crystal load requirement. These values are given by
the formula below:
PCin(pF) =PCout(pF)= [(CL(pF) – Cp(pF)/2)] x 2
Where CL is crystal load capacitor as given by the crystal datasheet and Cp(pF) is the compensation factor for the
total parasitic capacitance at XIN or XOUT pin including PCB related parasitic capacitance.
As an example; if a crystal with CL=18pF is used and Cp=4pF, by using the above formula, PCin=PCout=[(18-(4/2)] x
2 = 32pF. Programming PCin and PCout to 32pF assures that this crystal sees an equivalent load of 18pF and no
other external crystal load capacitor is needed. Deviating from the crystal load specification could cause an increase
in frequency accuracy in ppm. Refer to the Table 5 for the recommended crystal specifications.
Recommended External Crystal Specifications (XO Version)
Parameter
Description
Min
Typ
Max
Unit
Comments
FNOM
Nominal Crystal
Frequency Range
8
-
48
MHz
Fundamental Mode – AT Cut
CL
Nominal Crystal Load
6
12
18
pF
Load for +/-0 ppm Fo resonance
value
R1,1
Equivalent Series
Resistance
20
40
100
Ohm
F-Range: 8.0 to 12.999 MHz
R1,2
Equivalent Series
Resistance
12.5
25
60
Ohm
F-Range: 13.0 to 19.999 MHz
R1,3
Equivalent Series
Resistance
10
20
50
Ohm
F-Range: 20.0 to 48.000 MHz
DL1,1
Crystal Drive Level
-
200
W
F-Range: 8.0 to 19.999 MHz
DL1,2
Crystal Drive Level
-
150
W
F-Range: 20.0 to 48.000 MHz
Co1
Shunt Capacitance
-
4
5.4
pF
SMD Xtals
Co2
Shunt Capacitance
-
5
7.2
pF
Through Hole (Leaded) Xtals
Table 3. Crystal Specifications (XO Version)
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