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参数资料
| 型号： | SMDA05C.TB |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| 封装： | SOP-8 |
| 文件页数： | 5/7页 |
| 文件大小： | 180K |
| 代理商： | SMDA05C.TB |
5
2005 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Circuit Diagram
I/O Line Protection
Device Connection for Protection of Four Data Lines
The SMDAxxC series of devices are designed to protect
up to four data lines. The devices are connected as
follows:
The SMDAxxC are bidirectional devices and are
designed for use on lines where the normal operat-
ing voltage is above and below ground. Pins 1, 2,
3, and 4 are connected to the protected lines.
Pins 5, 6, 7, and 8 are connected to ground. Since
the device is electrically symmetrical, these connec-
tions may be reversed. The ground connections
should be made directly to the ground plane for
best results. The path length is kept as short as
possible to reduce the effects of parasitic induc-
tance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
1
2
3
45
6
7
8
Ground
From Connector
To Protected
Device
Typical Connection
1
2
3
45
6
7
8
Applications Information
相关PDF资料 |
PDF描述 |
|---|---|
| SMDA05CN-5.TE | 300 W, BIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE |
| SMDA05C | 300 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE |
| SMDA15 | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE |
| SMDA15C | 300 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE |
| SMDA12.T | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MS-012AA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SMDA05CTR | 功能描述:TVS DIODE 5VWM 9.8VC 8SO 制造商:smc diode solutions 系列:- 包装:剪切带（CT） 零件状态:在售 类型:齐纳 单向通道:- 双向通道:4 电压 - 反向关态（典型值）:5V（最大） 电压 - 击穿（最小值）:6V 电压 - 箝位（最大值）@ Ipp:9.8V 电流 - 峰值脉冲（10/1000μs）:- 功率 - 峰值脉冲:300W 电源线路保护:无 应用:通用 不同频率时的电容:300pF @ 1MHz 工作温度:-55°C ~ 125°C（TJ） 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商器件封装:8-SO 标准包装:1 |
| SMDA05E3/TR13 | 制造商:Microsemi Corporation 功能描述:4 LINE UNI-DIR, 300W (8/20US), STAND-OFF VOLTAGE = 5V - Tape and Reel 制造商:Microsemi Corporation 功能描述:TVS ARRAY UNIDIR 300W 5V 8SOIC |
| SMDA05E3/TR7 | 功能描述:TVS ARRAY UNIDIR 5.0 VWM SO-8 RoHS:是 类别:过电压，电流，温度装置 >> TVS - 二极管 系列:TVS Array™ 标准包装:1,800 系列:TransZorb® 电压 - 反向隔离（标准值）:28V 电压 - 击穿:31.1V 功率（瓦特）:400W 电极标记:双向 安装类型:表面贴装 封装/外壳:DO-214AC，SMA 供应商设备封装:DO-214AC（SMA） 包装:带卷 (TR) 其它名称:SMAJ28CA-E3/61-NDSMAJ28CA-E3/61GITR |
| SMDA05LC | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:LOW CAPACITANCE TVS ARRAY |
| SMDA05LCC | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:LOW CAPACITANCE TVS ARRAY |
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