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Device Overview
2.1 Device Characteristics
TMS320C6454
Fixed-Point Digital Signal Processor
SPRS311A–APRIL 2006–REVISED DECEMBER 2006
Table 2-1
, provides an overview of the C6454 DSP. The tables show significant features of the C6454
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type
with pin count.
Table 2-1. Characteristics of the C6454 Processor
HARDWARE FEATURES
EMIFA (64-bit bus width)
(clock source = AECLKIN or SYSCLK4)
DDR2 Memory Controller (32-bit bus width) [1.8 V I/O]
(clock source = CLKIN2)
EDMA3 (64 independent channels) [CPU/3 clock rate]
I2C
HPI (32- or 16-bit user selectable)
PCI (32-bit), [66-MHz or 33-MHz]
McBSPs (internal CPU/6 or external clock source up
to 100 Mbps)
10/100/1000 Ethernet MAC (EMAC)
Management Data Input/Output (MDIO)
64-Bit Timers (Configurable)
(internal clock source = CPU/6 clock frequency)
General-Purpose Input/Output Port (GPIO)
Size (Bytes)
C6454
1
1
1
1
Peripherals
1 (HPI16 or HPI32)
1 (PCI66 or PCI33)
Not all peripherals pins
are available at the same
time (For more detail, see
the
Device Configuration
section).
2
1
1
2 64-bit
or
4 32-bit
16
1144K
32K-Byte (32KB) L1 Program Memory Controller
[SRAM/Cache]
32KB Data Memory Controller [SRAM/Cache]
1048KB L2 Unified Memory/Cache
32KB L2 ROM
On-Chip Memory
Organization
C64x+ Megamodule
Revision ID
Megamodule Revision ID Register (address location:
0181 2000h)
See
Section 5.6
,
Megamodule Revision
See
Section 3.6
,
JTAG ID (JTAGID) Register
Description
720, 850, and 1000 (1 GHz)
1.39 ns (C6454-720), 1.17 ns (C6454-850),
1 ns (C6454-1000) [1 GHz CPU]
1.25 V (-1000)
1.2 V (-850/-720)
1.5/1.8 [EMAC RGMII], and
1.8 and 3.3 V [I/O Supply Voltage]
JTAG BSDL_ID
JTAGID register (address location: 0x02A80008)
Frequency
MHz
Cycle Time
ns
Core (V)
Voltage
I/O (V)
PLL1 and PLL1
Controller Options
CLKIN1 frequency multiplier
Bypass (x1), x15, x20, x25, x30, x32
CLKIN2 frequency multiplier
[DDR2 Memory Controller and EMAC support only]
PLL2
x20
697-Pin Flip-Chip Plastic BGA (ZTZ)
697-Pin Plastic BGA (GTZ)
0.09 μm
BGA Package
24 x 24 mm
Process Technology
μm
Product Preview (PP), Advance Information (AI),
or Production Data (PD)
Product Status
(1)
PP
(1)
PRODUCT PREVIEW information concerns experimental products (designated as TMX) that are in the formative or design phase of
development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or
discontinue these products without notice.
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