参数资料
| 型号： | 0001.2710.11 |
| 厂商： | Schurter Inc |
| 文件页数： | 1/3页 |
| 文件大小： | 0K |
| 描述： | FUSE 4A 250V 5X20 T-LAG SMD |
| 标准包装： | 100 |
| 系列： | SPT 5x20 |
| 保险丝类型： | 管筒，陶瓷 |
| 额定电流： | 4A |
| 额定电压 - AC： | 250V |
| 额定电压 - DC： | 150V |
| 响应时间： | 慢速 |
| 封装/外壳： | 5mm x 20mm |
| 安装类型： | 表面贴装 |
| 尺寸/尺寸： | 0.205" 直径 x 0.787" L（5.20mm x 20.00mm） |
| 额定电压时的断路容量： | 1500A |
| 熔化 I²t： | 62.4 |
| 批准： | cULus，VDE |
| 工作温度： | -55°C ~ 125°C |
| 包装： | 散装 |
Non resettable fuses
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, H, 250 VAC, Au plating
IEC 60127-2 · 250 VAC · 300 VDC · Time-Lag T
SMD-SPT
Description
- Directly solderable on printed circuit boards
- IEC Standard Fuse
- H = High Breaking Capacity
Standards
- IEC 60127-2/5
- UL 248-14
- CSA C22.2 no. 248.14
Approvals
- VDE Certificate Number: 40010881
- UL File Number: E41599
Technical Data
Applications
- Primary protection on SMD PCBs
References
Weblinks
Rated Voltage
Rated current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
Dimension
250 VAC, 300 VDC
1 - 16 A
500 A - 1500 A
Time-Lag T
PCB,SMT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Ceramic
Gold-Plated Copper Alloy
1g
0 °C to 60 °C, max. 70% r.h.
, Current, Dielectric strength, Cha-
racteristic, Breaking Capacity
20 mm
Soldering Methods
Solderability
Resistance to Soldering Heat
Resistance to Vibration
Moisture Resistance Test
Terminal Strength
Thermal Shock
Case Resistance
Resistance to Solvents
Reflow
245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
260 °C / 10 sec acc. to IEC 60068-2-
58, Test Td
acc. to IEC 60068-2-6, test Fc
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
Deflection of board 1 mm for 1 minute
MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
acc. to EIA/IS-722, Test 4.7
>100 M Ω (between leeds and body)
MIL-STD-202, Method 215A
10 ±0.2
20 ±0.5
Soldering pads
5.5
Fuses
9.5
5.5
1
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