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参数资料
| 型号： | 0015477750 |
| 厂商： | MOLEX INC |
| 元件分类： | 电路板相叠连接器 |
| 英文描述： | 50 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/2页 |
| 文件大小： | 29K |
| 代理商： | 0015477750 |
This document was generated on 12/07/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Active
Description:
2.54mm (.100") Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High
Temperature, Shrouded, with Peg, 50 Circuits, 0.76m (30") Gold (Au) Selective
Plating, Tin (Sn) PC Tail Plating
Documents:
General
Product Family
PCB Headers
Series
Application
Wire-to-Board
Product Name
C-Grid
Physical
Breakaway
No
Circuits (Loaded)
50
Color - Resin
Black
First Mate / Last Break
No
Flammability
94V-0
Glow-Wire Compliant
No
Guide to Mating Part
No
Keying to Mating Part
None
Lock to Mating Part
Yes
Material - Metal
Brass
Material - Metal
Phosphor Bronze
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
High Temperature Thermoplastic
Number of Rows
2
Orientation
Vertical
PC Tail Length (in)
0.130 In
PC Tail Length (mm)
3.30 mm
PCB Locator
No
PCB Retention
Yes
PCB Thickness Recommended (in)
0.093 In
PCB Thickness Recommended (mm)
2.40 mm
Packaging Type
Tube
Pitch - Mating Interface (in)
0.100 In
Pitch - Mating Interface (mm)
2.54 mm
Pitch - Term. Interface (in)
0.100 In
Pitch - Term. Interface (mm)
2.54 mm
Plating min: Mating (in)
30
Plating min: Mating (m)
0.75
Plating min: Termination (in)
75
Plating min: Termination (m)
1.875
Polarized to Mating Part
Yes
Polarized to PCB
Yes
Shrouded
Fully
Stackable
No
Surface Mount Compatible (SMC)
No
Temperature Range - Operating
-55°C to +105°C
Termination Interface: Style
Through Hole
Electrical
Series image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Not Reviewed
Need more information on product
environmental compliance?
Please visit the Contact Us section for any
non-product compliance questions.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 0015477752 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating |
| 0015477754 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating |
| 0015477756 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating |
| 0015477758 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating |
| 0015477760 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating |
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