型号: | 0390-0-15-15-08-80-10-0 |
厂商: | MILL-MAX MFG CORP |
元件分类: | 终端 |
英文描述: | BERYLLIUM COPPER, TIN (200) OVER NICKEL FINISH, PCB TERMINAL |
封装: | ROHS COMPLIANT |
文件页数: | 1/1页 |
文件大小: | 146K |
代理商: | 0390-0-15-15-08-80-10-0 |
相关PDF资料 |
PDF描述 |
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0389-4-15-80-08-27-10-0 | BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL |
0389-3-15-80-08-01-10-0 | BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL |
0389-4-15-15-08-01-10-0 | BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL |
0389-4-15-15-08-80-10-0 | BERYLLIUM COPPER, TIN (200) OVER NICKEL FINISH, PCB TERMINAL |
0389-4-15-15-08-27-10-0 | BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL |
相关代理商/技术参数 |
参数描述 |
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0390-0-15-80-08-14-10-0 | 制造商:Mill-Max Mfg Corp 功能描述:0390-0-15-80-08-14-10-0 |
0390-0-15-80-08-27-10-0 | 功能描述:电路板硬件 - PCB 200u SN OVER NI 8 CON RoHS:否 制造商:Harwin 类型:Shield Clip 长度:9.4 mm 螺纹大小: 外径: 材料:Beryllium Copper 电镀:Tin |
0390-0-15-80-08-80-10-0 | 功能描述:电路板硬件 - PCB 200u SN OVER NI 8 CON RoHS:否 制造商:Harwin 类型:Shield Clip 长度:9.4 mm 螺纹大小: 外径: 材料:Beryllium Copper 电镀:Tin |
039-0050 | 制造商:SPC Multicomp 功能描述:LOW DENSITY FOAM 305X305X6MM 制造商:SPC Multicomp 功能描述:LOW DENSITY FOAM, 305X305X6MM 制造商:SPC Multicomp 功能描述:LOW DENSITY FOAM, 305X305X6MM; Height:6mm; Width:305mm; Length:305mm; SVHC:No SVHC (19-Dec-2012); Colour:Black; ESD Storage Type:Foam; Kit Features:Conductive ;RoHS Compliant: Yes |
0390070222 | 制造商:Molex 功能描述:PCB TERM BLK 10MM 2 POLES - Bulk |