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参数资料
| 型号： | 0455600160 |
| 厂商： | Molex Inc |
| 文件页数： | 8/27页 |
| 文件大小： | 0K |
| 描述： | CONN PLUG CRADLE 16POS VERT SMD |
| 产品培训模块： | HandyLink™ Connectors |
| 产品目录绘图： | 45560 Series Vertical |
| 标准包装： | 290 |
| 系列： | HandyLink™ 45560 |
| 连接器类型： | 托架 |
| 连接器类型： | Handylink |
| 位置数： | 16 |
| 安装类型： | 表面贴装 |
| 端子： | 焊接 |
| 触点表面涂层： | 金 |
| 包装： | 带卷 (TR) |
| 配套产品： | WM17127DKR-ND - CONN RCPT 16POS .8MM RT/ANG SMD WM17127CT-ND - CONN RCPT 16POS .8MM RT/ANG SMD WM17127TR-ND - CONN RCPT 16POS .8MM RT/ANG SMD |
| 其它名称： | 045560-0160 045560-0160-P 0455600160-P 45560-0160 45560-0160-P 455600160 455600160-P WM17128TR |
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HANDYLINK?
APPLICATION SPECIFICATION
4.3 Clearances Between Mated Parts
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see
Section 6.4 Design Best Practices for further detailed information.
5.0 SOLDERING PROCESS RECOMMENDATIONS
5.1 44828 SMT Receptacle Connector
5.1.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.
5.1.2 Solder Paste Stencil Layout
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.
5.1.4
Inspection
Solder joints should be inspected using established conventional methods.
5.2 45560 SMT Cradle Connector
5.2.1 PCB Layout
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is
required.
5.2.2 Solder Paste Stencil Layout
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
8
REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
TITLE:
APPLICATION SPECIFICATION
HANDYLINK?I/O CONNECTOR SYSTEM
SHEET No.
8 of 27
DOCUMENT NUMBER:
SD-45560-001
CREATED / REVISED BY:
M. Simmel/D. Morgan
CHECKED BY:
M. Ibarra
APPROVED BY:
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
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