参数资料
型号: 0512484788
厂商: MOLEX INC
元件分类: 插座
英文描述: PGA478, IC SOCKET
文件页数: 1/1页
文件大小: 32K
代理商: 0512484788
This document was generated on 11/04/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Active
Description:
1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)
Mount, ZIF, 478 Circuits, Key Version B, with Pick and Place Cover, Tray Package,
Lead Free
Documents:
General
Product Family
Processor Sockets
Series
Comments
ZIF, with Pick and Place Cover
Component Type
Socket
Product Name
Micro PGA
Physical
Circuits (Loaded)
478
Circuits (maximum)
478
Color - Resin
Black
Color - Resin
Natural
Durability (mating cycles max)
50
Material - Metal
Copper-Nickel-Silicon
Material - Metal
Stainless Steel
Material - Plating Mating
Gold
Material - Plating Termination
Nickel
Material - Resin
High Temperature Thermoplastic
Packaging Type
Tray
Pitch - Mating Interface (in)
0.050 In
Pitch - Mating Interface (mm)
1.27 mm
Plating min: Mating (in)
10.16
Plating min: Mating (m)
0.254
Plating min: Termination (in)
98
Plating min: Termination (m)
1.5
Temperature Range - Operating
-20°C to +90°C
Termination Interface: Style
Surface Mount
Electrical
Current - Maximum
0.5A
Voltage - Maximum
100V
Solder Process Data
Lead-free Process Capability
Reflow Capable (SMT only)
Process Temperature max. C
240
Material Info
Reference - Drawing Numbers
Product Specification
PS-51248-020
Sales Drawing
SD-51248-015
* Pentium and Celeron are registered trademark of Intel Corporation
Series image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Not Reviewed
Need more information on product
environmental compliance?
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
51248 Series
Mates With
Intel Mobile Celeron* Processor-M|Intel
Mobile Pentium* 4 Processor
This document was generated on 11/04/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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0512484794 制造商:Molex 功能描述:1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium 4, Ball Grid Array (BGA) Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tape and Reel Package, 0.25?μm (10?μ") Gold (Au) Plating
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