参数资料
| 型号： | 0679130002 |
| 厂商： | Molex Inc |
| 文件页数： | 5/8页 |
| 文件大小： | 0K |
| 描述： | CONN MEMORY SD I/O BOTTM MT SMD |
| 视频文件： | SD Memory Card Connectors |
| 标准包装： | 1 |
| 系列： | 67913 |
| 卡类型： | 安全数字式 - SD |
| 位置数： | 12（9 + 3） |
| 连接器类型： | 连接器和弹出器 |
| 插入，移除方法： | 推入式，推出式 |
| 安装类型： | 表面贴装，直角 |
| 特点： | 板导轨，开关 |
| 板上方高度： | 0.108"（2.75mm） |
| 安装特点： | 反向 - 底部 |
| 包装： | 剪切带 (CT) |
| 触点表面涂层： | 金 |
| 产品目录页面： | 514 (CN2011-ZH PDF) |
| 其它名称： | WM23962CT |
LANGUAGE
PRODUCT SPECIFICATION
ENVIRONMENTAL
ENGLISH
Item
Vibration
Shock
Moisture Resistance
Solderability
Temperature Rise
Test Condition
Mate dummy card and sbject to the
following vibration conditions, for a period of
2 hours in each of 3 mutually perpendicular
axis, passing DC 1mA during the test.
Amplitude : 1.52mm P-P
Frequency : 10-55-10 Hz
shall be traversed in 1 minute.
( MIL-STD-202 Method 201 )
Mate dummy card and subject to the
following shock conditions. 3 shocks shall
be applied along 3 mutually perpendicular
axis, passing DC 1mA current during the
test. ( Total of 18 shocks)
Test Pulse: Half Sine.
Peak Value : 490m/s 2
Duration : 11ms
( MIL-STD-202 Method 213,)
Matedummy card and subject to the condi-
tions specified on per.( 6) for 9 cycles. The
test specimens shall exposed to step 7a
during only 5 out of 9 cycles. A 10th cycles
consisting of only step 1 through 6 is then
performed, after which the test specimens
shall be conditioned at ambient room condi-
tions for 24 hours.
(MIL-STD-202 Method 106)
Dip solder tails into the molten solder ( held
at 230 +5 o C/-5 o C ) up to 0.5mm from the tip
of tail for 3+/-0.5sec.
Mated with dummy card measure the
temperature rise at the rated current after
96 hours
Requirement
Appearance : No damage.
Contact resistance: 100 milliohms
MAX.
Discontinuity: 1 microsecond MAX.
Appearance : No damage.
Contact resistance: 100 milliohms
MAX.
Discontinuity: 1 microsecond MAX.
Appearance : No damage
Contact resistance: 100 milliohms
MAX.
Dielectric strength : Must meet
electrical requirement.
Insulation resistance : 100 Megohms
Minimum.
Solder coverage : 95 % Min.
Temperature rise
30 o C Maximum
A
REV
REVISE ON PC ONLY
SEE SHEET 1
DESCRIPTION
TITLE
SD MEMORY CARD CONNECTOR FOR CARD
HEADER WITH EJECTOR MECHANISM
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX
INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DOCUMENT NO.
DIMENSION CLASS:
FILE NAME
SHEET
PS-67913-002
C
RITICAL
=0
MAJOR = 0
PS-67913-002.
PDF
5
.PDF
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 0679130007 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.50mm (.098") Pitch, SDIO Memory Card Connector, Reverse Mount, Ultra Low Profile, with integrated shell nails, Lead-Free |
| 0679130008 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.50mm (.098) Pitch, SDIO Memory Card Connector, Reverse Mount, Ultra LowProfile, Push Push Type |
| 0679130011 | 制造商:Molex 功能描述:SD/IO CARD CONN. ASS'Y REVERSE TYPE - Tape and Reel |
| 0679138003 | 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.50mm (.098") Pitch, SDIO Memory Card Connector, Reverse Mount, Push Push Type, with Card Lock Pin and Mylar, Lead free |
| 0679138006 | 制造商:Molex 功能描述:Conn SD Card SKT 8 POS Solder RA SMD Embossed T/R 制造商:Molex 功能描述:SD/IO CARD CONN. ASS'Y - Tape and Reel |
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