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参数资料
| 型号： | 0737711190 |
| 厂商： | MOLEX INC |
| 元件分类： | 电路板相叠连接器 |
| 英文描述： | 144 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/2页 |
| 文件大小： | 35K |
| 代理商： | 0737711190 |
This document was generated on 11/06/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Active
Overview:
Description:
2.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical,
SMC, Press-Fit, Guide Pin Option, 144 Circuits
Documents:
General
Product Family
Backplane Connectors
Series
Application
Midplane
Component Type
PCB Header
Overview
HDM®
Product Name
HDM
Style
N/A
Physical
Circuits (Loaded)
144
Circuits (maximum)
144
Color - Resin
Black
Durability (mating cycles max)
250
Flammability
94V-0
Keying to Mating Part
Yes
Material - Metal
Phosphor Bronze
Material - Metal
Stainless Steel
Material - Plating Mating
Gold
Material - Plating Termination
Tin-Lead
Material - Resin
High Temperature Thermoplastic
Number of Columns
24
Number of Pairs
Open Pin Field
Number of Rows
6
Orientation
Vertical
PCB Retention
Yes
PCB Thickness Recommended (in)
0.098 In
PCB Thickness Recommended (mm)
2.50 mm
Packaging Type
Tube
Pitch - Mating Interface (in)
0.079 In
Pitch - Mating Interface (mm)
2.00 mm
Plating min: Mating (in)
30
Plating min: Mating (m)
0.75
Plating min: Termination (in)
15
Plating min: Termination (m)
0.375
Polarized to PCB
No
Surface Mount Compatible (SMC)
Yes
Temperature Range - Operating
-55°C to +105°C
Termination Interface: Style
Through Hole - Compliant Pin
Electrical
CSA
LR19980
Current - Maximum
1A
Data Rate
1.0 Gbps
Voltage - Maximum
250V AC
Material Info
Series image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Not Reviewed
Need more information on product
environmental compliance?
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
73771 Series
Mates With
73632 HDM PLUS Board-to-Board
Daughterboard Receptacle, 73780 HDM
Board-to-Board Daughtercard Receptacle
Application Tooling
| FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description
Product #
Extraction Tool
HDM Backplane
Insertion Signal
Contact Tool
HDM Backplane
Insertion Head for
144 Positions
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相关代理商/技术参数 |
参数描述 |
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| 0737711200 | 功能描述:HDM BP STKG MOD WGP PF 30SAU GF 制造商:molex, llc 系列:HDM?（高密度） 73771 包装:管件 零件状态:有效 连接器用途:- 连接器类型:接头，公引脚 连接器样式:HDM? 导轨 A 针脚数:144 加载的针脚数:全部 间距:0.079"（2.00mm） 排数:6 列数:24 安装类型:通孔 端接:压配式 触头布局（典型）:- 特性:可叠加 触头镀层:金 触头镀层厚度:30μin（0.76μm） 颜色:黑 额定电流:1A 材料可燃性等级:UL94 V-0 工作温度:-55°C ~ 105°C 额定电压:250V 标准包装:72 |
| 0737711300 | 功能描述:HDM BP STKG MOD POLGDE PF 30SAU 制造商:molex, llc 系列:HDM?（高密度） 73771 包装:管件 零件状态:过期 连接器用途:- 连接器类型:接头，公引脚 连接器样式:HDM? 导轨 A 针脚数:144 加载的针脚数:全部 间距:0.079"（2.00mm） 排数:6 列数:24 安装类型:通孔 端接:压配式 触头布局（典型）:- 特性:可叠加 触头镀层:金 触头镀层厚度:30μin（0.76μm） 颜色:黑 额定电流:1A 材料可燃性等级:UL94 V-0 工作温度:-55°C ~ 105°C 额定电压:250V 标准包装:72 |
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