参数资料
型号: 0768710006
厂商: Molex Inc
文件页数: 6/17页
文件大小: 0K
描述: QSFP+ ASSEMBLY 2X1 ELASTOMER
应用说明: QSFP+ Stacked Application Spec
特色产品: QSFP and QSFP+ Interconnect Solutions
标准包装: 45
系列: 76871
连接器类型: 带机架的插座,成组(2x1)
连接器类型: QSFP+
位置数: 76(38 x 2)
安装类型: 通孔,直角
端子: 压配式
特点: EMI 屏蔽,光管
触点表面涂层:
触点涂层厚度: 30µin(0.76µm)
包装: 托盘
配套产品: WM1161-ND - CONN CABLE ASSEMBLY QSFP M-M 3M
WM1160-ND - CONN CABLE ASSEMBLY QSFP M-M 1M
其它名称: 076871-0006
WM6170
PRODUCT SPECIFICATION
QSFP+ STACKED CONNECTORS
6.2 TEST GROUP 2
ITEM
1
TEST
Low Level
Contact
TEST PROCEDURE
EIA-364-23; apply a
maximum voltage of 20 mV
CONDITION
Mated
REQUIREMENT
baseline
ACTUAL
N/A
Resistance
and a current of 100 mA.
2
Durability
(precondition)
EIA-364-09; perform plug &
unplug cycles: 20
No evidence of physical
damage
PASS
EIA-364-32, test condition I
3
Thermal Shock
(10 cycles):
120 hours
Mated
None
Low Level
EIA-364-23; apply a
4
Contact
maximum voltage of 20 mV
Mated
<10 m
? max
<10 m
? max
Resistance
and a current of 100 mA.
EIA-364-31
Cycle connectors between
Mated
Cyclic
25 o ± 3 oC at 80% RH and 65
5
Temperature
& Humidity
o± 3 oC at 50 % RH ( 24
cycles) Ramp times should
None
be 0.5 hour and dwell should
be 1.0 hour.
Low Level
EIA-364-23; apply a
6
Contact
maximum voltage of 20 mV
Mated
<10 m
? max
<10 m
? max
Resistance
and a current of 100 mA.
7
Reseating
Manually unplug & plug the
connector, 3 cycles
No evidence of physical
damage
PASS
Low Level
EIA-364-23; apply a
8
Contact
maximum voltage of 20 mV
Mated
<10 m
? max
<10 m
? max
Resistance
and a current of 100 mA.
REVISION:
D
ECR/ECN INFORMATION: TITLE:
EC No: UCP2012-2334
DATE: 2012 / 01 / 25
PRODUCT SPECIFICATION
STACKED QSFP+ CONNECTORS
SHEET No.
6 of 17
DOCUMENT NUMBER:
PS-76870-001
CREATED / REVISED BY:
S. BOGIEL/JGONZALEZ
CHECKED BY:
HAVERY
APPROVED BY:
M. BANAKIS
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
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