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参数资料
| 型号： | 0780350202 |
| 厂商： | MOLEX INC |
| 元件分类： | 边缘插接连接器 |
| 英文描述： | 200 CONTACT(S), FEMALE, 22.5 DEGREE SINGLE PART CARD EDGE CONN, SURFACE MOUNT, SOCKET |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/2页 |
| 文件大小： | 30K |
| 代理商： | 0780350202 |
This document was generated on 11/04/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Active
Description:
0.60mm (.024") Pitch miniDIMM DDR Socket, Surface Mount, 22.5° Reverse Angle,
0.76m (30") Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 200
Circuits, 2.5V Voltage Key, Lead-free
Documents:
General
Product Family
Memory Module Sockets
Series
Comments
<LI>Latches in Off-White Color
Component Type
Socket
JEDEC Outline
MO-258
Product Name
MiniDIMM
Physical
Circuits (Loaded)
200
Color - Resin
Black
Color - Resin
Natural (White)
Durability (mating cycles max)
25
Entry Angle
22.5° Angle
Flammability
94V-0
Keying to Mating Part
Yes
Material - Metal
Copper Alloy
Material - Plating Mating
Gold
Material - Plating Termination
Tin
Material - Resin
High Temperature Thermoplastic
PCB Locator
Yes
PCB Retention
Yes
Packaging Type
Tray
Pitch - Mating Interface (in)
0.024 In
Pitch - Mating Interface (mm)
0.60 mm
Plating min: Mating (in)
30
Plating min: Mating (m)
0.76
Plating min: Termination (in)
100
Plating min: Termination (m)
2.54
Temperature Range - Operating
-10°C to +85°C
Termination Interface: Style
Surface Mount
Electrical
CSA
LR 19980
Current - Maximum
1A
UL
E29179
Voltage - Maximum
30V
Voltage Key
2.5V
Solder Process Data
Duration at Max. Process Temperature (seconds)
5
Lead-free Process Capability
Reflow Capable (SMT only)
Max. Cycles at Max. Process Temperature
1
Process Temperature max. C
260
Material Info
Reference - Drawing Numbers
Series image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Not Reviewed
Need more information on product
environmental compliance?
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
78035 Series
Mates With
JEDEC MO-258 modules
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