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参数资料
| 型号： | 08-3518-10 |
| 厂商： | ARIES ELECTRONICS INC |
| 元件分类： | 插座 |
| 英文描述： | 8 PIN SOLDER TAIL DIP SOCKET |
| 中文描述： | DIP18, IC SOCKET |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/2页 |
| 文件大小： | 1311K |
| 代理商： | 08-3518-10 |
FRENCHTOWN, NJ USA
TEL (908) 996-6841 FAX (908) 996-3891
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
12016
Rev. F
FEATURES
Open Frame allows Efficient Utilization of Board Space with Optimized Cooling
Choose from Several Pin Styles
Compatible with Automatic Insertion Equipment
Side-to-Side and End-to-End Stackable
SPECIFICATIONS
Body Material is black UL 94V-0 glass-filled 4/6 Nylon
Pin Body is Brass Alloy 360 1/2-hard per UNS C36000 ASTM B16-00
Pin Body Plating 10μ [0.25μm] min. Gold per MIL-G-45204
or
200μ [5.08μm] min. 93/7 Tin/Lead per ASTM B545
or
200μ [5.08μm] min. Tin per ASTM B545 Type 1 over 100μ [2.54μm] min. Nickel per SAE AMS-QQ-N-290
4-fingered Collet Contact is Beryllium-Copper Alloy per UNS C17200 ASTM B194-01
Contact Plating 200μ [5.08μm] min. 93/7 Tin/Lead per ASTM B545
or
200μ [5.08μm] min. Tin per ASTM B545 Type 1
or
10μ [0.25μm] Gold per MIL-G-45204 over 50μ min. [1.27μm] Nickel per SAE AMS-QQ-N-290
Available Plating = Heavy Gold 30μ [0.76μm]
Contact Current Rating = 3 amps
Operating Temperature = 221°F [105°C] Tin and Tin/Lead plating = 257°F [125°C] Gold plating
Insertion Force = 180 grams/pin
Withdrawal Force = 90 grams/pin
Normal Force = 140 grams/pin
Midget Pin Insertion Force = 370 grams/pin
Midget Pin Withdrawal Force = 150 grams/pin
Midget Pin Normal Force = 240 grams/pin, based on a 0.018 [0.46] dia. test lead
Accepts Lead Lengths from 0.100 [2.54] min. and 0.015-0.025 [0.38-0.64] in dia.
Accepts Midget Pin Lead Lengths from 0.080 [2.03] and up to 0.022 [0.56] dia.
MOUNTING CONSIDERATIONS
Suggested PCB Hole Size for Solder Pin Tail and Extra Long Pin = 0.030 ±0.002 [0.76 ±0.05] dia.
Suggested PCB Hole Size for Midget Pin = 0.040 ±0.002 [1.02 ±0.05] dia.
Series 518 Open Frame Collet
Sockets w/Solder Pin Tails – 1 of 2
相关PDF资料 |
PDF描述 |
|---|---|
| 06-3518-11 | DIP16, IC SOCKET |
| 08-3518-10TL | DIP18, IC SOCKET |
| 06-3518-10 | DIP16, IC SOCKET |
| 06-3518-10E | DIP16, IC SOCKET |
| 08-3518-10E | DIP18, IC SOCKET |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 08-3518-10E | 功能描述:IC 与器件插座 OPEN FRAME COLLET SOLDER TAIL 8 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 08-3518-10H | 功能描述:IC 与器件插座 OPEN FRAME COLLET SOLDER TAIL 8 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 08-3518-10M | 功能描述:IC 与器件插座 OPEN FRAME COLLET SOLDER TAIL 8 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 08-3518-10T | 功能描述:IC 与器件插座 OPEN FRAME COLLET SOLDER TAIL 8 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 08-3518-11 | 功能描述:IC 与器件插座 OPEN FRAME COLLET SOLDER TAIL 8 PINS RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
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