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参数资料
| 型号： | 08055C332K-MR |
| 英文描述： | CAP. 3.3NF MINIREEL 500PCS |
| 中文描述： | 第。 3.3NF MINIREEL 500件 |
| 文件页数： | 10/12页 |
| 文件大小： | 328K |
| 代理商： | 08055C332K-MR |
42
WAVE SOLDERING
Component Spacing
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less impor-
tant for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
Preheat & Soldering
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
Surface Mounting Guide
MLC Chip Capacitors
D1
D2
D3
D4
D5
Case Size
D1
D2
D3
D4
D5
0603
3.10 (0.12)
1.20 (0.05)
0.70 (0.03)
1.20 (0.05)
0.75 (0.03)
0805
4.00 (0.15)
1.50 (0.06)
1.00 (0.04)
1.50 (0.06)
1.25 (0.05)
1206
5.00 (0.19)
1.50 (0.06)
2.00 (0.09)
1.50 (0.06)
1.60 (0.06)
1210
5.00 (0.19)
1.50 (0.06)
2.00 (0.09)
1.50 (0.06)
2.50 (0.10)
Dimensions in millimeters (inches)
≥1mm (0.04)
≥1.5mm (0.06)
≥1mm (0.04)
相关PDF资料 |
PDF描述 |
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| 08055C333K-MR | CAP. 33NF MINIREEL 500PCS |
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| 06035C332K-MR | CAP. 3.3NF MINIREEL 500PCS |
| 06035C471K-MR | CAP. 470PF MINIREEL 500PCS |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 08055C332MAT2A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 50V 3300pF 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 08055C333J4T2A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 50volts 33000pF 5% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 08055C333J4T4A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 50V 0.033uF 5% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 08055C333JAT2A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.033uF 50volts X7R 5% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 08055C333JAT2A/4K | 制造商:AVX Corporation 功能描述:CAP CER 0.033UF 50V 5% X7R 0805 |
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