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| 型号： | 0810B50-75J |
| 厂商： | ANAREN INC |
| 元件分类： | 射频变压器 |
| 英文描述： | 800 MHz - 1000 MHz RF TRANSFORMER |
| 文件页数： | 1/12页 |
| 文件大小： | 680K |
| 代理商： | 0810B50-75J |
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model 0810B50-75J
Rev A
Ultra Low Profile 0805 Balun
50 to 150 Balanced
Description
The 0810B50-75J is a low profile sub-miniature balanced to unbalanced
transformer designed for differential inputs and output locations on next generation
wireless chipsets in an easy to use surface mount package covering the
GSMfrequency. The 0810B50-75J is ideal for high volume manufacturing and is
higher performance than traditional ceramic, and lumped element baluns. The
0810B50-75J has an unbalanced port impedance of 50
and a 150 balanced port
impedance**. This transformation enables single ended signals to be applied to
differential ports on modern semiconductors. The output ports have equal amplitude
(-3dB) with 180 degree phase differential. The 0810B50-75J is available on tape and
reel for pick and place high volume manufacturing.
Detailed Electrical Specifications*: Specifications subject to change without notice.
ROOM (25
°C)
Parameter
Min.
Typ.
Max
Unit
Frequency
800
1000
MHz
Unbalanced Port Impedance
50
Balanced Port Impedance**
150
Return Loss
13
18
dB
Insertion Loss***
0.85
1.1
dB
Amplitude Balance
±0.4
±0.6
dB
Phase Balance
±4
±7
Degrees
Power Handling
0.5
Watts
Thermal Resistance
TBD
C / Watt
Features:
800 – 1000 MHz
0.7mm Height Profile
50 Ohm to 2 x 75 Ohm
GSM/CDMA
Low Insertion Loss
Input to Output DC Isolation
Surface Mountable
Tape & Reel
Non-conductive Surface
Operating Temperature
-55
+85
C
*Specification based on performance of unit properly installed on micro-strip printed circuit boards with 50
nominal impedance.
** 75
reference to ground. *** Insertion Loss stated at room temperature (1.2 dB Max at +85 C)
Pin Configuration
Balun Pin Configruation
λ 4
The internal configuration of the ultra-low profile balun is diagramed to
the left; the unbalanced port is terminated in an open-circuit and the
two balanced ports are connected to ground. The ground connection
for the two balanced ports are connected together and brought out on
a common pin of the balun. This pin is labeled “DC/RF ground”. For
many chipset applications there is an opportunity to use this
configuration as a single bias point if applicable.
The use of differential circuits is increasing in highly integrated circuits,
because of its inherent noise immunity properties. Differential circuits
have superior performance when looking at properties like cross
coupling, immunity to external noise sources and power supply noise.
When designing power amplifiers differential circuits also help
minimize 2
nd and 3rd order intermodulation products.
The construction of the ultra-low profile balun is bonded multi-layered
stripline made of low loss dielectric material with plated through vias
connecting the internal circuitry to the external printed circuit board,
similar to that of other Xinger
hybrids and directional couplers
.
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