参数资料
型号: 1-5-468MP
厂商: 3M (TC)
文件页数: 5/9页
文件大小: 0K
描述: TAPE TRANSFER ADHESIVE 1" X 5YD
产品培训模块: Laminating Adhesive Families
Tapes PSA Technology 101
MSDS 材料安全数据表: 467MP,468MP,9667MP,9668MP(L) MSDS
标准包装: 1
系列: 468MP
胶带类型: 胶粘传输带
胶合剂: 丙烯酸,200MP
背衬,载体: 聚乙烯涂层牛皮纸内衬
厚度: 0.0093"(9.3 mils,0.236mm)
厚度 - 胶合剂: 0.0051"(5.1 mils,0.130mm)
厚度 - 背胶,载体,衬垫: 0.0042"(4.2 mils,0.107mm)
宽: 1.00"(25.40mm)
长度: 15'(4.6m)5 码
颜色: 透明
使用: 连接件,高温应用
温度范围: 70 ~ 100°F(21 ~ 38°C)
包装: 散装
其它名称: 3M9721
3M? Adhesive Transfer Tapes with Adhesive 200MP
467MP, 468MP, 467MPF, 468MPF, 7952MP, 7955MP, 7962MP, 7965MP, 9172MP,
9185MP, 9667MP, 9668MP
Environmental
Performance
Humidity Resistance – High humidity has a minimal effect on
adhesive performance. Bond strength shows no significant reduction
after exposure for 7 days at 90 ? F (32 ? C) and 90% relative humidity.
UV Resistance – When properly applied, nameplates and decorative
trim parts are not adversely affected by outdoor exposure.
Water Resistance – Immersion in water has no appreciable effect on
the bond strength. After 100 hours at room temperature, the high bond
strength is maintained.
Temperature Cycling Resistance – High bond strength is maintained
after cycling four times through:
4 hours at 158 ? F (70 ? C)
4 hours at -20 ? F (-29 ? C)
4 hours at 73 ? F (22 ? C)
Chemical Resistance – When properly applied, nameplate and
decorative trim parts will hold securely after exposure to numerous
chemicals including oil, mild acids and alkalis.
Bond Build-up: The bond strength of 3M? High Performance Acrylic
Adhesive 200MP increases as a function of time and temperature
Temperature/Heat Resistance: 3M? High Performance Acrylic
Adhesive 200MP is usable for short periods (minutes, hours) at
temperatures up to400 ? F (204 ? C) and for intermittent longer periods
(days, weeks) up to 300 ? F (149 ? C).
Lower Temperature Service Limit: The glass transition temperature
for 3M? High Performance Acrylic Adhesive 200MP is -31°F (-35°C).
Many applications survive below this temperature (factors affecting
successful applications include: materials being bonded, dwell at RT
before cold exposure, and stress below the TG[i.e.expansion/contraction
stresses, impact]). Optimum conditions are: bonding high surface energy
materials, longer time at RT before cold exposure, and little or no stress
below the TG. The lowest service temperature is -40°F (-40°C).
5
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