参数资料
| 型号： | 100MM-1M-5515-20 |
| 厂商： | 3M (TC) |
| 文件页数： | 2/4页 |
| 文件大小： | 0K |
| 描述： | THERMAL INTERFACE PAD 100MM |
| 标准包装： | 1 |
| 系列： | 5515-20 |
| 使用： | 卷，可裁 |
| 形状： | 矩形 |
| 外形： | 1m x 100.00mm |
| 厚度： | 0.008"（0.203mm） |
| 材质： | 硅质 |
| 胶合剂： | 胶粘 - 两侧 |
| 背衬，载体： | 聚对苯二甲二乙酯（PET） |
| 导热性： | 3.0 W/m-K |
| 其它名称： | 3M10326 |
3M
Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25
(2)
Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and should not be
used for specification purposes.
3M Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25
Property
Method
Value
3M Thermally Conductive Silicone Pad 5515-20 and 5515-25
Thickness (mm)
–
0.20 / 0.25 (±0.025mm)
Thermal conductivity (W/m-K)
QTM-500
3.0
Flammability
UL94
V-0 (Passed 3M Internal FR Test)
Density (g/cm
3,@ 25°C)
TS-TM-441
2.9 (±0.15)
Hardness Shore 00
ASTM D2240
80 (±10)
Volume resistivity (
-cm)
ASTM D257
4.5 x10
14
Dielectric Strength (kV/mm)
ASTM D149
14.5
Dielectric constant
ASTM D150
100Hz
1Khz
1Mhz
16.0
15.6
15.7
Duration (hrs)
Initial
100
1000
2000
Thermal Conductivity (W/m-K)
3.0
3.1
Hardness Shore 00
82
83
Appearance
–
No effect
Environmental Aging Testing: 3M Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25
Aged at 130°C in high temperature chamber.
Application Ideas
IC Packaging Thermal Interface Material (TIM)
Printed Circuit Board Heat Sink TIM
Aluminum Heat Sink Block
COF Chip Heat Conduction to adjacent substrate
LED Board TIM
HD TV Address IC Chip and Scan Module
Thin Gap Filling between board module and chassis
Mechanical fastening such as clamp, bracket, screw and additional tapes and adhesives bonding can be used in parallel with
this pad. 3M silicone PSA 9122 is an adhesive option to use with the 3M Thermally Conductive Silicone Interface Pad
5515 if higher adhesion is desired in an application.
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