参数资料
型号: 101-1218
厂商: Rabbit Semiconductor
文件页数: 15/130页
文件大小: 0K
描述: KIT APPLCTN RABBITCORE RCM4010
标准包装: 1
系列: RabbitCore®
主要目的: *
嵌入式: *
已用 IC / 零件: RCM4010
主要属性: *
次要属性: *
已供物品: 板,模块,250GB 网络驱动器,线缆,CD,电源
其它名称: 316-1156
User’s Manual
105
B.4.1 Adding Other Components
There are pads for 28-pin TSSOP devices, 16-pin SOIC devices, and 6-pin SOT devices
that can be used for surface-mount prototyping with these devices. There are also pads that
can be used for SMT resistors and capacitors in an 0805 SMT package. Each component
has every one of its pin pads connected to a hole in which a 30 AWG wire can be soldered
(standard wire wrap wire can be soldered in for point-to-point wiring on the Prototyping
Board). Because the traces are very thin, carefully determine which set of holes is con-
nected to which surface-mount pad.
B.4.2 Measuring Current Draw
The Prototyping Board has a current-measurement feature available at header locations
JP1 and JP2 for the +5 V and +3.3 V supplies respectively. To measure current, you will
have to cut the trace on the bottom side of the Prototyping Board corresponding to the
power supply or power supplies whose current draw you will be measuring. Header loca-
tions JP1 and JP2 are shown in Figure B-5. Then install a 1 × 2 header strip from the
Development Kit on the top side of the Prototyping Board at the header location(s) whose
trace(s) you cut. The header strip(s) will allow you to use an ammeter across their pins to
measure the current drawn from that supply. Once you are done measuring the current,
place a jumper across the header pins to resume normal operation.
Figure B-5. Prototyping Board Current-Measurement Option
NOTE: Once you have cut the trace below header location JP1 or JP2, you must either be
using the ammeter or have a jumper in place in order for power to be delivered to the
Prototyping Board.
A
0
Cut traces
Bottom Side
JP1
JP2
JP1 (+5 V)
or
JP2 (+3.3 V)
CURRENT
MEASUREMENT
D1
R1
PWR
DS1
GND
J1
U1
C1
GND
C2
JP1
C3
D2
JP2
L1C6
C5
JP1
JP2
相关PDF资料
PDF描述
0982660995 CBL 29POS 0.5MM JMPR TYPE A 5"
1812R-103J INDUCTOR UNSHIELDED 10UH SMD
0982660994 CBL 29POS 0.5MM JMPR TYPE D 5"
1812R-102J INDUCTOR UNSHIELDED 1.0UH SMD
CDMC6D28NP-1R0MC POWER INDUCTOR 1.0UH SHIELD SMD
相关代理商/技术参数
参数描述
10-11-2183 功能描述:集管和线壳 18P CRIMP RAMP HSNG RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector
10-11-2184 制造商:MOLEX 制造商全称:Molex Electronics Ltd. 功能描述:2.54mm (.100") Pitch KK?? Crimp Terminal Housing, High Pressure, 1 Circuits
10-11-2193 功能描述:集管和线壳 KK 100 Housing Crimp Ramp 19 Ckt RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector
10-11-2194 功能描述:集管和线壳 KK 100 Housing Crimp Pol Ramp 19 Ckt RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector
10-11-2203 功能描述:集管和线壳 20 CKT CRIMP RAMP HOUSING RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector