参数资料
型号: 101-1226
厂商: Rabbit Semiconductor
文件页数: 146/168页
文件大小: 0K
描述: RCM3900 DEV KIT UNIVERSAL
标准包装: 1
系列: RabbitCore 3900
类型: MPU 模块
适用于相关产品: RCM3900
所含物品: RabbitCore 模块、开发板、交流适配器、缆线和 Dynamic C? 光盘
其它名称: 316-1137
RabbitCore RCM3900 User’s Manual
79
Table A-4 lists the delays in gross memory access time.
The measurements are taken at the 50% points under the following conditions.
T = -40°C to 85°C, V = VDD ±10%
Internal clock to nonloaded CLK pin delay
1 ns @ 85°C/3.0 V
The clock to address output delays are similar, and apply to the following delays.
Tadr, the clock to address delay
TCSx, the clock to memory chip select delay
TIOCSx, the clock to I/O chip select delay
TIORD, the clock to I/O read strobe delay
TIOWR, the clock to I/O write strobe delay
TBUFEN, the clock to I/O buffer enable delay
The data setup time delays are similar for both Tsetup and Thold.
When the spectrum spreader is enabled with the clock doubler, every other clock cycle is
shortened (sometimes lengthened) by a maximum amount given in the table above. The
shortening takes place by shortening the high part of the clock. If the doubler is not
enabled, then every clock is shortened during the low part of the clock period. The maxi-
mum shortening for a pair of clocks combined is shown in the table.
Technical Note TN227, Interfacing External I/O with Rabbit 2000/3000 Designs, con-
tains suggestions for interfacing I/O devices to the Rabbit 3000 microprocessors.
Table A-4. Data and Clock Delays VIN ±10%, Temp, -40°C–+85°C (maximum)
VIN
Clock to Address Output Delay
(ns)
Data Setup
Time Delay
(ns)
Spectrum Spreader Delay
(ns)
30 pF
60 pF
90 pF
Normal
no dbl/dbl
Strong
no dbl/dbl
3.3 V
6
8
11
1
3/4.5
4.5/9
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